XCKU15P-L1FFVE1517I

The XCKU15P-L1FFVE1517I is an AMD Kintex® UltraScale+™ field programmable gate array (FPGA) in a 1517-FCBGA package. It provides a high count of programmable logic and embedded memory along with a large I/O complement, packaged for surface-mount assembly and specified for industrial temperature operation.

With approximately 1,143,450 logic elements, roughly 82.33 Mbits of embedded memory and 512 I/O pins, this device is intended for designs that require significant on-chip logic density, embedded RAM capacity, and extensive external connectivity while operating within an industrial temperature range.

Key Features

• Programmable Logic  Approximately 1,143,450 logic elements and 65,340 configurable logic blocks (CLBs) provide large-scale programmable resources for complex digital designs.
• Embedded Memory  Approximately 82.33 Mbits of on-chip RAM to support buffering, LUT-based storage and memory-intensive functions directly on the FPGA fabric.
• I/O Capacity  512 general-purpose I/O pins enable extensive external interfacing for high-channel-count designs and multiple peripheral connections.
• Package & Mounting  1517-FCBGA (40×40) ball grid array package, surface-mount mounting for compact board-level integration.
• Power Supply Range  Core supply specification from 698 mV to 876 mV, allowing clear power budgeting and regulation planning for the FPGA core.
• Operating Temperature  Industrial temperature range rated from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Regulatory Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• High-density digital processing  Large logic and CLB counts support complex finite-state machines, custom processors, and heavy combinational logic implementations.
• Memory-intensive functions  Approximately 82.33 Mbits of embedded RAM enables on-chip buffering, data aggregation and intermediate storage for streaming and packet-processing tasks.
• Multi-channel I/O systems  With 512 I/O pins, the device suits designs requiring broad external connectivity such as multi-channel data acquisition, aggregation, or interface bridging.
• Industrial control and instrumentation  Industrial-grade temperature rating and surface-mount packaging make the device appropriate for factory automation, motion control, and industrial communication endpoints that need high logic density.

Unique Advantages

• High on-chip logic capacity:  Approximately 1,143,450 logic elements allow consolidation of multiple functions into a single device, reducing board-level part counts.
• Substantial embedded memory:  Roughly 82.33 Mbits of RAM reduces dependence on external memory for many buffering and intermediate storage tasks, simplifying system design.
• Extensive I/O connectivity:  512 I/O pins support high channel counts and diverse peripheral interfacing without additional bridging components.
• Industrial temperature support:  Rated −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Surface-mount FCBGA package:  1517-FCBGA (40×40) package enables dense PCB layouts and is suitable for automated assembly processes.
• RoHS compliant:  Supports lead-free manufacturing flows and regulatory compliance for many global markets.

Why Choose XCKU15P-L1FFVE1517I?

The XCKU15P-L1FFVE1517I positions itself as a high-capacity, industrial-grade FPGA that combines substantial programmable logic, significant embedded RAM and a large I/O complement in a compact FCBGA package. Its electrical and thermal specifications support reliable deployment in designs that demand on-chip resources and robust environmental performance.

This device is well suited for engineers and teams building complex digital systems that benefit from consolidating functionality on a single FPGA—offering scalability for dense logic, memory-backed processing, and extensive external interfacing while aligning with RoHS manufacturing requirements.

Request a quote or submit an inquiry for pricing and availability to get started with XCKU15P-L1FFVE1517I for your next high-density FPGA design.