XCKU15P-L2FFVE1517E

The XCKU15P-L2FFVE1517E is a Kintex® UltraScale+™ FPGA from AMD, offered in a 1517-FCBGA (40×40) surface-mount package. It provides a large configurable logic capacity and substantial on-chip memory, along with a high I/O count for complex, programmable digital systems.

With approximately 1,143,450 logic elements and roughly 82.3 Mbits of embedded memory, this extended-grade device targets designs that require dense programmable logic, abundant memory resources and extensive I/O connectivity while operating over a 0 °C to 100 °C temperature range.

Key Features

• Logic Capacity  Approximately 1,143,450 logic elements to support large-scale programmable designs and complex logic implementations.
• Embedded Memory  Approximately 82.3 Mbits of on-chip RAM for buffering, lookup tables and memory-intensive functions.
• I/O Resources  512 I/O pins to support wide interface fan-out and multiple peripheral connections.
• Package & Mounting  1517-FCBGA (40×40) package in a surface-mount footprint for compact, high-density board layouts.
• Power Supply  Operates from a core voltage supply in the range of 698 mV to 876 mV, enabling low-voltage core designs.
• Operating Grade & Temperature  Extended grade with an operating temperature range of 0 °C to 100 °C for a broad set of environmental conditions.
• Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital systems  Use the device’s large logic capacity and embedded memory to implement complex state machines, datapaths and custom processing pipelines.
• Memory-centric designs  Leverage approximately 82.3 Mbits of on-chip RAM for buffering, packet queues or local data storage in FPGA-implemented subsystems.
• I/O-intensive modules  Employ the 512 I/O pins to aggregate and interface multiple high-pin-count peripherals or crossbar connections.

Unique Advantages

• High logic density: Approximately 1,143,450 logic elements enable consolidation of large functions into a single device, simplifying system architecture.
• Substantial on-chip memory: Roughly 82.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O connectivity: 512 I/Os provide design flexibility for interfacing and system partitioning without immediate need for additional GPIO expanders.
• Compact package: 1517-FCBGA (40×40) surface-mount package supports high-density PCB layouts while keeping the solution footprint manageable.
• Extended operating range: Extended-grade qualification and 0 °C to 100 °C operation offer predictable behavior across common thermal environments.
• Low-voltage core operation: Core supply between 698 mV and 876 mV helps designs targeting lower-power core domains.

Why Choose XCKU15P-L2FFVE1517E?

The XCKU15P-L2FFVE1517E positions itself as a high-capacity, memory-rich FPGA option within the Kintex® UltraScale+™ family, suited for projects that require significant programmable logic, abundant embedded RAM and a large number of I/Os in a compact FCBGA package. Its extended-grade classification and RoHS compliance add predictability for production deployments.

This device is well suited for engineers and teams building high-density programmable systems who need on-chip memory and extensive I/O resources while maintaining a compact board footprint and low-voltage core operation.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU15P-L2FFVE1517E.