XCKU19P-1FFVB2104I

The XCKU19P-1FFVB2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) from AMD, supplied in a 2104-FCBGA package. It provides a high-density programmable fabric with 1,842,750 logic elements and approximately 63.8 Mbits of embedded on-chip RAM, designed for demanding digital designs that require large logic capacity and significant memory resources.

With 540 user I/Os, surface-mount packaging, an industrial operating range and a narrow core voltage window, this device targets applications requiring substantial integration, predictable thermal and electrical conditions, and long-term platform scalability.

Key Features

• Core Capacity — 1,842,750 logic elements provide extensive programmable resource for complex digital logic and algorithm implementation.
• Embedded Memory — Approximately 63.8 Mbits of on-chip RAM available for buffering, LUT-based storage and local data handling.
• I/O — 540 user I/Os to support wide parallel interfaces, high-pin-count connectivity and flexible system integration.
• Package & Mounting — 2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount form factor for compact board-level integration.
• Power — Core supply requirement specified between 825 mV and 876 mV for consistent power-domain planning.
• Temperature Range — Industrial-grade operation from −40 °C to 100 °C suitable for a broad range of environmental conditions.
• Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density digital processing — Implement large combinational and sequential logic functions using the extensive logic-element count and embedded RAM.
• Data buffering and packet handling — Use the on-chip memory and numerous I/Os for buffering, packet staging and wide bus interfacing.
• System prototyping and platform development — Leverage the programmable fabric and high I/O count for evaluating complex system architectures.

Unique Advantages

• Large programmable fabric: 1,842,750 logic elements enable substantial integration of logic and control functions on a single device, reducing external component count.
• Significant on-chip memory: Approximately 63.8 Mbits of embedded RAM supports local data storage and high-throughput buffering without relying entirely on external memory.
• High I/O density: 540 user I/Os allow broad parallel connectivity and flexible interface mapping for complex system designs.
• Industrial operating range: Rated for −40 °C to 100 °C to meet temperature requirements in industrial deployments.
• Compact BGA package: 2104-FCBGA (47.5 × 47.5 mm) surface-mount package balances high pin count with board-level packaging efficiency.
• RoHS compliant: Supports environmentally conscious manufacturing and regulatory compliance.

Why Choose XCKU19P-1FFVB2104I?

The XCKU19P-1FFVB2104I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex UltraScale+ family, offering substantial logic and memory resources alongside a high I/O count and a compact 2104-FCBGA mounting. Its specified core voltage window and extended temperature range support designs that require controlled power domains and reliable operation across industrial environments.

This device is suited for teams and projects that need scalable programmable fabric, dense on-chip memory and extensive connectivity on a single package—providing a foundation for complex digital processing, buffering and system prototyping with long-term platform stability.

Request a quote or submit your requirements to obtain pricing and availability for the XCKU19P-1FFVB2104I. Our team can provide part pricing, lead-time information and order support.