XCKU19P-1FFVB2104E

The XCKU19P-1FFVB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) provided in a 2104-FCBGA package. It offers a very large programmable fabric with substantial embedded memory and a high I/O count for designs that require significant on-chip resources.

With 1,842,750 logic elements, approximately 64 Mbits of embedded memory, and 540 user I/Os, this device is targeted at applications and designs that need high logic density, large internal storage, and broad external connectivity while operating within an extended-grade temperature range.

Key Features

• Programmable Logic Capacity  1,842,750 logic elements provide extensive programmable fabric for complex logic implementation and system integration.
• Embedded Memory  Approximately 64 Mbits of on-chip RAM (63,753,421 bits) support large buffering, data staging, and state storage without immediate external memory dependency.
• I/O Density  540 user I/Os enable broad interfacing options for high-pin-count systems and multi-channel connectivity.
• Power Supply  Core voltage supply range of 825 mV to 876 mV for the device’s internal power domain.
• Package & Mounting  Supplied in a 2104-BBGA / 2104-FCBGA footprint (47.5 × 47.5 mm) with surface-mount construction for board-level integration.
• Operating Range & Grade  Extended-grade device with an operating temperature range of 0°C to 100°C suitable for extended commercial environments.

Typical Applications

• High-density logic designs  Implement complex custom logic functions and large parallel datapaths using the device’s extensive logic element count.
• Memory-intensive processing  Leverage approximately 64 Mbits of embedded RAM for buffering, frame storage, and intermediate data handling in on-chip workflows.
• High I/O systems  Use the 540 I/Os to connect multiple external devices, sensors, or high-channel-count interfaces directly to the FPGA fabric.

Unique Advantages

• Very large programmable fabric: 1,842,750 logic elements enable integration of complex functions and consolidation of multiple functions into a single device.
• Substantial on-chip memory: Approximately 64 Mbits of RAM reduce reliance on external memory for many buffer and storage requirements.
• Extensive external connectivity: 540 I/Os provide flexibility for multi-channel designs and dense peripheral interfacing.
• Compact, industry-standard package: 2104-FCBGA (47.5 × 47.5 mm) offers a high-pin-count, surface-mount solution for systems requiring large I/O and routing density.
• Extended-grade operation: Rated for 0°C to 100°C operation to support designs targeting extended commercial temperature ranges.
• Defined core voltage window: Core supply specified between 825 mV and 876 mV to guide power design and regulator selection.

Why Choose XCKU19P-1FFVB2104E?

The XCKU19P-1FFVB2104E is positioned as a high-capacity, highly integrated FPGA option that combines nearly two million logic elements with substantial embedded memory and a large I/O complement. These characteristics make it suitable for designs that need to consolidate complex logic, on-chip data storage, and extensive external connectivity in a single device.

Its extended-grade rating, defined core voltage range, and 2104-FCBGA package provide a clear set of physical and electrical parameters for system designers focused on scalability, integration, and predictable board-level implementation.

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