XCKU19P-1FFVJ1760I

The XCKU19P-1FFVJ1760I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 1760-FCBGA package. It provides very large programmable logic capacity, extensive embedded RAM, and a high I/O count for designs that require dense on-chip resources and robust industrial operation.

With a wide operating temperature range and a low-voltage core supply window, this device is aimed at applications that need significant logic density, substantial on-chip memory, and broad connectivity while meeting industrial environmental requirements.

Key Features

• Logic Capacity  Approximately 1,842,750 logic elements, enabling very large-scale programmable logic implementations.
• Embedded Memory  Approximately 63.75 Mbits of on-chip RAM, suitable for buffering, lookup tables, and local data storage.
• I/O Density  540 I/O pins to support multiple high-pin-count interfaces and parallel connectivity.
• Power  Core voltage supply range of 825 mV–876 mV to match system power-rail requirements.
• Package  1760-FCBGA (1760-BBGA) package with a 42.5 mm × 42.5 mm footprint for high-density board integration.
• Mounting & Grade  Surface-mount device specified as Industrial grade for -40°C–100°C operation.
• Standards  RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital processing  Leverage the 1,842,750 logic elements and large embedded RAM for complex custom accelerators and data-path implementations.
• Multi-channel I/O systems  Use the 540 I/O pins to interface with multiple serial and parallel peripherals or to support multi-lane communications.
• Industrial control and automation  Industrial-grade temperature range and robust package make the device suitable for control systems and factory automation equipment.

Unique Advantages

• High logic density: The large count of logic elements enables integration of complex state machines, datapaths, and custom processing blocks on a single device.
• Substantial on-chip memory: Approximately 63.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O: 540 I/Os provide flexibility for multi-interface designs and board-level consolidation.
• Industrial operating range: Rated for -40°C to 100°C operation to support deployment in temperature-demanding environments.
• Compact high-pin-count package: 1760-FCBGA (42.5×42.5 mm) balances high integration with a board-friendly form factor.
• RoHS compliance: Supports lead-free manufacturing and regulatory conformance for commercial and industrial products.

Why Choose XCKU19P-1FFVJ1760I?

The XCKU19P-1FFVJ1760I combines very large logic capacity, significant embedded memory, and a high I/O count in a 1760-FCBGA package specified for industrial temperatures. This combination supports designs that require consolidated functionality on a single FPGA while maintaining board-level efficiency and environmental robustness.

Choose this device when your project requires high integration density, extensive on-chip RAM, and broad connectivity options, with the assurance of RoHS compliance and a defined industrial operating range for long-term deployments.

Request a quote or submit an inquiry to get pricing and availability for the XCKU19P-1FFVJ1760I.