XCKU19P-2FFVJ1760I

The XCKU19P-2FFVJ1760I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760-FCBGA package. It delivers very high logic density, substantial embedded memory, and a large number of I/O pins for complex, I/O-intensive and compute-heavy industrial designs.

Designed for surface-mount assembly and rated for industrial operation, this device provides a combination of logic capacity, on-chip RAM, and I/O count that supports high-integration FPGA-based systems within the specified voltage and temperature ranges.

Key Features

• Logic Capacity  Approximately 1,842,750 logic cells and 105,300 CLBs, providing extensive fabric capacity for complex logic and custom processing pipelines.
• Embedded Memory  Approximately 63.75 Mbits of on-chip RAM to support deep buffering, local storage, and memory-intensive accelerators without external memory for some workloads.
• I/O Resources  540 I/O pins to support wide external connectivity, parallel interfaces, and dense board-level integration.
• Package & Mounting  1760-FCBGA (42.5×42.5 mm) package in a surface-mount format to support compact, high-density PCB layouts.
• Power Supply Range  Specified core voltage range of 825 mV to 876 mV for the device core supply.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly and materials.

Typical Applications

• Industrial Control  Leverages industrial temperature rating, high logic capacity, and numerous I/Os for complex control, real-time monitoring, and automation systems.
• High‑density FPGA Designs  Extensive logic cells and on-chip RAM enable implementation of large FPGA fabrics, system-on-chip functions, and custom accelerators.
• I/O‑intensive Systems  540 I/Os support multi-channel interfaces, high-bandwidth data aggregation, and dense board-level connectivity.
• Embedded Processing and Acceleration  Substantial embedded memory and logic resources suitable for localized buffering, protocol processing, and hardware acceleration tasks.

Unique Advantages

• High Logic Density: The combination of ~1.84 million logic cells and 105,300 CLBs enables large-scale, highly parallel designs on a single device.
• Significant On‑Chip Memory: Approximately 63.75 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs, simplifying BOM and board routing.
• Extensive I/O Count: 540 I/Os provide flexibility for multi-channel interfaces, sensors, and external peripherals without additional bridge devices.
• Industrial Temperature Qualification: Rated from −40 °C to 100 °C to support deployments in demanding environmental conditions.
• Compact FCBGA Package: 1760-FCBGA (42.5×42.5) surface-mount package enables high-density PCB implementations while maintaining robust connectivity.
• Manufacturer Backing: Produced by AMD, offering access to a known FPGA product family and manufacturing support.

Why Choose XCKU19P-2FFVJ1760I?

The XCKU19P-2FFVJ1760I positions itself as a high-capacity Virtex® UltraScale+™ FPGA for industrial and high‑integration applications that need large logic fabrics, substantial embedded memory, and broad I/O support. Its combination of logic cells, on-chip RAM and 540 I/Os enables complex system integration on a single device while the industrial temperature rating supports deployment in harsh environments.

This device is suited for engineers and system designers building dense FPGA-based solutions where in‑device memory, large logic resources, and a high I/O count drive system-level consolidation and long-term scalability. RoHS compliance and standard surface-mount packaging support modern manufacturing processes and regulatory needs.

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