XCKU19P-L1FFVJ1760I

The XCKU19P-L1FFVJ1760I is a high-density Virtex® UltraScale+™ FPGA IC from AMD, supplied in a 1760-FCBGA package. It combines a very large pool of programmable logic, substantial embedded memory, and a high I/O count in a surface-mount FCBGA footprint designed for industrial-class environments.

Engineered for designs that require extensive on-chip resources and robust operating conditions, this device targets applications demanding high logic capacity, significant embedded RAM, and broad peripheral connectivity while meeting industrial temperature requirements.

Key Features

• High Logic Density — 1,842,750 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory — approximately 64 Mbits of on-chip RAM (63,753,421 bits) to support buffering, state storage, and data processing tasks without external memory.
• Extensive I/O — 540 I/O pins for broad peripheral interfacing, multi-channel connectivity, and system integration.
• Power Supply Range — operates with a core voltage supply range of 698 mV to 742 mV as specified for device power planning.
• Industrial Temperature Range — rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — supplied in a 1760-FCBGA package (42.5 × 42.5 mm) with surface-mount mounting for dense PCB integration.
• Compliance — RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density digital processing — implement large, custom datapaths and control logic using the device’s 1,842,750 logic elements and substantial on-chip RAM.
• Multi-channel I/O systems — systems requiring many parallel interfaces can take advantage of the 540 available I/O pins for sensors, transceivers, or peripheral buses.
• Industrial embedded systems — suitable for industrial deployments that need a surface-mount FPGA with an operating range from −40 °C to 100 °C.

Unique Advantages

• Massive programmable capacity: 1,842,750 logic elements enable consolidation of complex functions into a single FPGA, reducing system-level component count.
• Significant on-chip memory: approximately 64 Mbits of embedded RAM reduces dependence on external memory and improves data throughput and latency.
• Broad connectivity: 540 I/O pins provide flexibility to interface with numerous peripherals and high-channel-count systems without external multiplexing.
• Industrial readiness: rated for −40 °C to 100 °C operation for reliable use in demanding environments.
• Compact board-level integration: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density PCB designs.
• Regulatory compliance: RoHS compliant for environmentally conscious product development.

Why Choose XCKU19P-L1FFVJ1760I?

The XCKU19P-L1FFVJ1760I combines very high logic element capacity, substantial embedded memory, and an extensive I/O complement in a rugged industrial-rated FPGA package. It is suited to designs that require consolidation of complex digital functions, significant on-chip buffering, and numerous external interfaces while meeting industrial temperature requirements.

For engineering teams focused on high-capacity, scalable FPGA implementations, this device offers the on-chip resources and form factor necessary to reduce system complexity and support long-term design objectives in industrial applications.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the XCKU19P-L1FFVJ1760I.