XCKU19P-3FFVJ1760E

The XCKU19P-3FFVJ1760E is a Virtex UltraScale+ field programmable gate array (FPGA) in a 1760-ball FCBGA package. It provides a high logic density fabric with substantial embedded memory and a large number of I/O for complex, programmable digital designs.

Key on-chip resources include 1,842,750 logic elements and approximately 63.75 Mbits of embedded memory, alongside 540 user I/O pins. The device is offered in an extended grade, RoHS-compliant package with a specified operating temperature range and supply voltage window for consistent system integration.

Key Features

• Core Logic — 1,842,750 logic elements and 105,300 CLBs provide extensive programmable logic capacity for complex designs and large-scale integration.
• Embedded Memory — Approximately 63.75 Mbits of on-chip RAM to support buffering, caching, and large state machines without external memory.
• I/O — 540 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power — Core voltage supply specified from 873 mV to 927 mV for defined power domain planning and thermal design.
• Package & Mounting — 1760-BBGA (1760-FCBGA) surface-mount package, supplier device package 1760-FCBGA (42.5 × 42.5 mm) for compact board-level integration.
• Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density data processing — Large logic count and substantial embedded RAM enable on-chip data path implementation and parallel processing.
• Complex programmable systems — Extensive CLBs and logic elements support multi-function system integration and custom hardware acceleration.
• I/O-intensive designs — 540 I/O pins allow interfacing with numerous peripherals, sensors, and external subsystems.

Unique Advantages

• Large programmable fabric: 1,842,750 logic elements accommodate highly parallel or deeply pipelined architectures without immediately requiring external logic.
• Significant on-chip memory: Approximately 63.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 540 I/O pins simplify board-level routing for multi-channel and multi-interface designs.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) balances device density with board footprint for space-constrained applications.
• Defined electrical and thermal window: Specified core voltage range (873–927 mV) and operating temperature (0–100 °C) enable predictable system-level power and thermal planning.
• RoHS compliant: Meets environmental lead-free requirements for regulatory and supply-chain compatibility.

Why Choose XCKU19P-3FFVJ1760E?

The XCKU19P-3FFVJ1760E is positioned for designs that require very large programmable logic capacity, substantial embedded memory, and a high count of I/O in a single, surface-mount FCBGA package. Its combination of 1,842,750 logic elements, approximately 63.75 Mbits of on-chip RAM, and 540 I/O pins supports integration of complex, multi-function digital subsystems on a single device.

This device is suitable for engineering teams seeking a scalable FPGA platform with clearly specified electrical and thermal parameters (873–927 mV supply, 0–100 °C operating range) and RoHS compliance, helping to simplify long-term design planning and supply-chain considerations.

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