XCKU19P-L2FFVB2104E

The XCKU19P-L2FFVB2104E is a Virtex® UltraScale+™ FPGA from AMD, providing a high-density programmable logic platform in a 2104-FCBGA package. It combines a large number of logic elements and on-chip memory with a high I/O count to address complex, logic- and memory-intensive designs.

This surface-mount, extended-grade device operates from 0 °C to 110 °C with a core voltage range of 698 mV to 742 mV, and is supplied in a 2104-BBGA FCBGA (47.5 × 47.5 mm) package.

Key Features

• Logic Capacity  1,842,750 logic elements for implementing large-scale programmable logic and combinational/sequential designs.
• Embedded Memory  Approximately 63.75 Mbits of on-chip RAM for buffering, FIFOs, and on-chip storage of intermediate datasets.
• High I/O Count  540 user I/O pins to support multi-channel interfaces, parallel busses, and broad peripheral connectivity.
• Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) package in a surface-mount ball-grid array for compact board-level integration.
• Power Supply  Core voltage specified from 698 mV to 742 mV to match low-voltage core power domains.
• Operating Range and Grade  Extended grade device rated for 0 °C to 110 °C operation.

Typical Applications

• High-density programmable systems  Deploy large logic resources and on-chip RAM where custom logic and data buffering are required in a single device.
• Multi-channel I/O platforms  Leverage 540 I/O pins for designs that require extensive parallel interfaces or multiple peripheral connections.
• Compute acceleration and custom processing  Use abundant logic elements and embedded memory to implement application-specific accelerators and datapath pipelines.

Unique Advantages

• High on-chip capacity: 1,842,750 logic elements and approximately 63.75 Mbits of embedded memory reduce the need for external logic and RAM components.
• Broad I/O support: 540 I/O pins enable dense system-level integration and flexible interface options on a single device.
• Compact packaging: 2104-FCBGA (47.5 × 47.5 mm) delivers high integration density while supporting surface-mount board assembly.
• Extended operating range: Rated 0 °C to 110 °C for deployments that require extended-temperature operation.
• Low-voltage core operation: Core supply range of 698 mV to 742 mV supports modern low-voltage power domains and power-constrained designs.

Why Choose XCKU19P-L2FFVB2104E?

The XCKU19P-L2FFVB2104E positions itself as a high-density Virtex® UltraScale+™ FPGA option for engineers who need extensive programmable logic, substantial on-chip memory, and a large I/O complement in a compact FCBGA package. Its extended-grade temperature rating and defined core voltage range make it suitable for demanding board-level designs that prioritize integration and capacity.

This device is appropriate for customers designing complex, memory- and I/O-heavy systems that require a single-chip programmable solution with proven package and electrical characteristics from AMD.

Request a quote or contact sales to check pricing, availability, and lead time for XCKU19P-L2FFVB2104E.