XCKU19P-L2FFVJ1760E

The XCKU19P-L2FFVJ1760E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for high-density programmable logic applications. It integrates approximately 1,842,750 logic elements, approximately 63.75 Mbits of embedded memory, and a 540-pin I/O capability in a 1760-FCBGA (42.5×42.5 mm) package.

This device is targeted at designs that require high logic capacity, substantial on-chip memory, and large I/O connectivity while operating within an extended temperature range and a tightly specified supply voltage window.

Key Features

• Core Logic  Approximately 1,842,750 logic elements provide extensive programmable fabric for complex digital designs.
• Embedded Memory  Approximately 63.75 Mbits of on-chip RAM to support buffering, packet queues, and large FPGA data structures.
• I/O Capacity  540 I/O pins to accommodate wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting  1760-BBGA / 1760-FCBGA package (42.5×42.5 mm) with surface-mount assembly for compact board integration.
• Power  Specified operating supply range from 698 mV to 742 mV to match tight core-voltage requirements.
• Temperature & Grade  Extended grade operation rated from 0 °C to 110 °C for deployments requiring wider-than-commercial thermal range.
• Compliance  RoHS compliant for regulatory-conforming material and process considerations.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory to implement complex algorithmic and data-path functions.
• Interface aggregation and bridging  High I/O count enables consolidation of multiple parallel interfaces and protocol translation on a single device.
• Large-buffering and packet handling  Substantial on-chip RAM supports packet queues, FIFOs, and buffering for data-streaming applications.

Unique Advantages

• Significant logic capacity: Approximately 1.84M logic elements let you implement large, integrated designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 63.75 Mbits of on-chip RAM reduces external memory dependence and simplifies board layout for data-intensive functions.
• High I/O density: 540 I/O pins support multiple external interfaces and complex mixed-signal connections on a single FPGA.
• Compact, surface-mount package: 1760-FCBGA (42.5×42.5 mm) enables high-pin-count implementation in a space-efficient footprint.
• Controlled core supply range: Tight supply specification (698–742 mV) provides predictable power design and voltage management for the FPGA core.
• Extended temperature operation: Rated for 0 °C to 110 °C to meet systems that require broader thermal performance than standard commercial parts.

Why Choose XCKU19P-L2FFVJ1760E?

The XCKU19P-L2FFVJ1760E combines large-scale programmable logic, significant embedded RAM, and a high I/O count in a single 1760-FCBGA surface-mount package. Its defined core voltage range and extended temperature rating make it suitable for designs that demand predictable power behavior and wider thermal operation.

This device is well suited for engineers and procurement teams building complex, memory- and I/O-intensive systems who need a scalable FPGA platform with clear, verifiable specifications and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to get pricing and availability for the XCKU19P-L2FFVJ1760E and to discuss your project requirements.