XCKU3P-1FFVB676I

The XCKU3P-1FFVB676I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 676-FCBGA (27×27) package and designed for surface-mount applications. This industrial-grade device delivers high logic density, substantial on-chip memory, and a broad I/O count to support complex programmable logic implementations.

Key on-device specifications include approximately 355,950 logic elements, roughly 31.64 Mbits of embedded memory, 280 I/O signals, a nominal supply range of 825 mV to 876 mV, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  Approximately 355,950 logic elements to implement complex programmable logic and custom hardware acceleration.
• Embedded Memory  Approximately 31.64 Mbits of on-chip RAM for buffering, state machines, and data-path storage.
• I/O Capacity  280 I/O signals to interface with sensors, peripherals, and external buses in dense system designs.
• Power  Operates within a supply range of 825 mV to 876 mV, enabling precise power management and system-level integration.
• Package & Mounting  676-BBGA, FCBGA package (27×27) with surface-mount mounting for compact board-level integration.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C to meet demanding temperature environments.
• Compliance  RoHS compliant to support modern environmental requirements.

Typical Applications

• High-density digital processing  Use the device where large programmable logic capacity and on-chip RAM are required for custom data processing and hardware acceleration.
• Interface consolidation  Leverage the 280 I/O signals to aggregate and bridge multiple peripherals and external interfaces on a single programmable device.
• Industrial systems  Deploy in industrial environments that require an extended operating temperature range and industrial-grade components.

Unique Advantages

• High logic capacity: Approximately 355,950 logic elements allow complex designs to be implemented without resorting to multiple devices, simplifying board layout.
• Substantial embedded memory: Roughly 31.64 Mbits of on-chip RAM supports data buffering and state retention internally, reducing external memory needs.
• Broad I/O count: 280 I/O signals provide flexibility for dense connectivity and multi-protocol interfacing.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Compact FCBGA package: 676-FCBGA (27×27) surface-mount package enables high integration density on space-constrained PCBs.
• RoHS compliant: Meets current environmental compliance expectations for lead-free assemblies.

Why Choose XCKU3P-1FFVB676I?

The XCKU3P-1FFVB676I positions itself as a high-density, industrial-grade FPGA option for designers who need significant on-chip logic and memory in a compact FCBGA package. Its combination of approximately 355,950 logic elements, roughly 31.64 Mbits of embedded RAM, and 280 I/O signals supports consolidated designs that reduce bill-of-materials and simplify system architecture.

This device is suited to engineering teams building robust, space-efficient programmable logic solutions that require predictable operating characteristics (825 mV–876 mV supply range and −40 °C to 100 °C temperature rating) and compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU3P-1FFVB676I. Our team can provide the procurement details you need to move your design forward.