XCKU3P-1FFVB676I
IC FPGA 280 I/O 676FCBGA
| Part Description | Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 280 31641600 355950 676-BBGA, FCBGA |
|---|
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Leadtime | 16 Weeks |
| Datasheet | |
| Quantity | 773 Available |
Specifications
| Part Package | 676-BBGA, FCBGA |
|---|---|
| Device Package | 676-FCBGA (27×27) |
| Mounting Method | Surface Mount |
| Voltage | 0.825V ~ 0.876V |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Number of LABs/CLBs: | 20340 |
| Number of Logic Elements/Cells: | 355950 |
| Total RAM Bits: | 31641600 |
| Number of I/O: | 280 |
| Voltage – Supply: | 0.825V ~ 0.876V |
Environmental
| REACH Compliance | REACH Unknown |
|---|---|
| RoHS Compliance | ROHS3 Compliant |
| Moisture Sensitivity Level | 4 (72 Hours) |
| ECCN | 3A991D |
| HTS Code | 8542.39.0001 |
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Advanced Micro Devices (AMD)
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Industry: Semiconductors
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
