XCKU3P-1SFVB784I

The XCKU3P-1SFVB784I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC optimized for designs that require high logic density, substantial on-chip memory, and a significant number of I/O. This surface-mount device is supplied in a 784-FCBGA package and is qualified for industrial temperature operation.

Key on-chip resources include 355,950 logic elements, approximately 31.64 Mbits of embedded memory, and 256 I/O pins. The device operates from a core voltage supply range of 825 mV to 876 mV and is RoHS compliant.

Key Features

• Core Logic  355,950 logic elements provide a large programmable fabric for complex FPGA implementations and parallel processing.
• Embedded Memory  Approximately 31.64 Mbits of on-chip RAM to support buffering, caching, and data-path storage within the FPGA fabric.
• I/O Capacity  256 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting  784-BFBGA (784-FCBGA, 23×23) surface-mount package suitable for compact PCB layouts.
• Power  Core voltage supply range of 825 mV to 876 mV to meet system power-rail requirements.
• Temperature Range  Rated for industrial operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant for adherence to common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the device’s high logic count and industrial temperature range for motor control, PLC functionality, and factory automation systems.
• Networking and Data Transport  Leverage the combination of logic elements and on-chip RAM for packet processing, protocol bridging, and custom forwarding engines.
• Signal Processing and Instrumentation  Large embedded memory and programmable logic support buffering and real-time processing in test equipment and measurement systems.
• Custom I/O Aggregation  256 I/Os allow for dense sensor interfacing, breakout aggregation, and mixed-signal front-end control in embedded platforms.

Unique Advantages

• High Logic Density: 355,950 logic elements enable complex designs and large-scale parallel implementations without immediate redesign.
• Substantial On-Chip Memory: Approximately 31.64 Mbits of embedded RAM reduces the need for external memory in many buffering and data-path applications.
• Robust I/O Count: 256 I/O pins provide flexibility for multi-channel interfaces and varied peripheral connectivity.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact BGA Package: The 784-FCBGA (23×23) surface-mount package balances high integration with a PCB footprint suitable for dense system designs.
• Defined Power Envelope: A tight core voltage range (825 mV–876 mV) enables predictable power design and supply planning.

Why Choose XCKU3P-1SFVB784I?

The XCKU3P-1SFVB784I is positioned for designs that demand a combination of high programmable logic capacity, substantial internal memory, and broad I/O while maintaining an industrial temperature rating. Its package and surface-mount form factor support compact, high-density board layouts.

This part is suited to engineers developing industrial automation, communications, signal processing, and embedded systems that require scalable logic resources, on-chip memory for data handling, and a predictable power and thermal envelope for reliable operation.

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