XCKU3P-2FFVB676I

The XCKU3P-2FFVB676I is a field programmable gate array (FPGA) from AMD's Kintex® UltraScale+™ family. It integrates a large programmable fabric with significant embedded memory and a substantial I/O count in a 676-ball FCBGA surface-mount package.

With 355,950 logic elements, approximately 31.6 Mbits of on-chip RAM, 280 I/Os, and an industrial operating temperature range, this device is suited to designs that require high logic capacity, on-chip storage, and robust environmental tolerance while operating on a low-voltage supply.

Key Features

• Logic Capacity  355,950 logic elements for implementing complex digital designs and large-scale logic functions.
• Configurable Logic Blocks (CLBs)  20,340 CLBs to structure and deploy programmable logic resources efficiently.
• Embedded Memory  Approximately 31.6 Mbits of on-chip RAM for buffering, local storage, and memory-intensive processing.
• I/O Resources  280 I/Os to support wide interfacing options and parallel connectivity.
• Power Supply  Core voltage range of 825 mV to 876 mV for low-voltage operation.
• Package  676-FCBGA (27×27) surface-mount package, offered as a 676-BBGA/FCBGA variant for compact board integration.
• Operating Temperature  Industrial grade temperature range from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance  RoHS Compliant.

Typical Applications

• Signal Processing  On-chip memory and large logic resources enable implementation of complex filtering, FFTs, and other DSP functions directly in programmable logic.
• Communications and Networking  High logic capacity and plentiful I/Os support protocol processing, packet handling, and custom network functions.
• Industrial Control  Industrial temperature rating and flexible I/O make the device suitable for automation controllers, motor control interfaces, and factory systems.
• Hardware Acceleration and Prototyping  Large logic and memory resources allow prototyping of custom accelerators and fixed-function hardware blocks.

Unique Advantages

• Large programmable fabric: 355,950 logic elements provide capacity for complex, multi-module designs without external logic expansion.
• Substantial on-chip memory: Approximately 31.6 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Extensive I/O: 280 I/Os enable broad interfacing options and parallel data paths for high-throughput designs.
• Industrial temperature capability: −40 °C to 100 °C operating range supports deployment in environments with wide temperature variation.
• Compact, board-ready package: 676-FCBGA (27×27) surface-mount package balances footprint and I/O density for system integration.
• Low-voltage core operation: 0.825 V to 0.876 V supply minimizes core power domain complexity in multi-rail designs.

Why Choose XCKU3P-2FFVB676I?

The XCKU3P-2FFVB676I combines a large logic element count, significant embedded memory, and a high I/O count in a compact 676-FCBGA package with industrial temperature capability. These characteristics make it well suited for engineers designing systems that need on-chip compute density, local memory, and flexible interfacing while operating across a wide temperature range.

For teams focused on scalable FPGA-based solutions, this Kintex® UltraScale+™ device offers a balance of integration, resource density, and industrial-grade environmental tolerance that supports medium- to large-scale digital designs and hardware acceleration projects.

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