XCKU3P-2SFVB784E

The XCKU3P-2SFVB784E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD that delivers a high-density, programmable logic fabric for complex digital designs. It integrates a large number of logic elements, substantial embedded memory, and a broad I/O complement to support demanding applications that require substantial on-chip resources and flexible interfacing.

With 355,950 logic elements, approximately 31.6 Mbits of embedded memory, and 304 user I/Os in a 784-FCBGA (23×23) package, this device targets designs that need high logic density, significant on-chip RAM, and extensive external connectivity while operating within an extended temperature range.

Key Features

• Programmable Logic Resources 355,950 logic elements and 20,340 CLBs provide a large, reconfigurable fabric for implementing complex digital functions and custom datapaths.
• Embedded Memory Approximately 31.6 Mbits of on-chip RAM to support buffering, lookup tables, and block-based storage for data-intensive processing.
• High Pin Count I/O 304 user I/Os enable extensive external interfacing for sensors, transceivers, memory, and peripheral connectivity.
• Power Requirements Core voltage supply range of 825 mV to 876 mV for the device core power domain.
• Package and Mounting 784-BFBGA (784-FCBGA, 23×23) surface-mount package that supports high-density board integration.
• Operating Range and Grade Extended-grade device rated for 0 °C to 100 °C operation.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• High-performance digital signal processing — Large logic capacity and substantial on-chip RAM support compute-heavy DSP kernels and custom filtering pipelines.
• Network and communications systems — Broad I/O and programmable fabric enable protocol implementation, packet processing, and custom interface logic.
• Hardware acceleration and prototyping — Dense logic and memory resources make the device suitable for accelerating algorithms and validating system architectures in FPGA-based prototypes.
• Embedded vision and image processing — On-chip RAM and plentiful logic elements help implement frame buffering, preprocessing, and parallel image pipelines.

Unique Advantages

• High-density programmable fabric: 355,950 logic elements and 20,340 CLBs provide the capacity to implement large, complex designs on a single device, reducing multi-chip complexity.
• Significant on-chip memory: Approximately 31.6 Mbits of embedded RAM supports data buffering and state storage without immediate reliance on external memory.
• Extensive I/O connectivity: 304 user I/Os allow flexible interfacing to a wide range of peripherals, sensors, and high-speed links.
• Compact BFBGA package: 784-FCBGA (23×23) surface-mount package enables dense PCB integration while delivering high pin count.
• Extended operating range: Rated for 0 °C to 100 °C operation, suitable for deployments that require a broader-than-commercial temperature window.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally conscious designs.

Why Choose XCKU3P-2SFVB784E?

The XCKU3P-2SFVB784E positions itself as a high-capacity Kintex UltraScale+ FPGA that balances logic density, embedded memory, and I/O breadth for systems requiring substantial on-chip resources. It is well suited to engineers and teams building high-throughput processing, communication, and prototyping platforms where a single, highly programmable device can simplify system architecture.

Backed by AMD's Kintex UltraScale+ family, the device offers a scalable option for designs that may grow in complexity over time, delivering long-term value through field reprogrammability and the ability to consolidate functions onto a single FPGA package.

Request a quote or submit an inquiry for XCKU3P-2SFVB784E to obtain pricing, availability, and configuration details for your project.