XCKU3P-2SFVB784I

The XCKU3P-2SFVB784I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC in a 784-ball FCBGA package. It provides a large logic fabric, substantial on-chip RAM, and a broad I/O complement for complex, programmable digital designs.

Built for industrial environments, this device targets designs that require significant logic capacity, embedded memory, and flexible I/O while operating across a wide temperature range and a defined core supply voltage window.

Key Features

• Logic Capacity — 355,950 logic elements and 20,340 configurable logic blocks (CLBs) to implement complex digital functions and custom compute pipelines.
• Embedded Memory — Approximately 31.6 Mbits of on-chip RAM for buffering, FIFOs, and storage of intermediate data without external memory.
• I/O Resources — 304 I/O pins to support wide peripheral connectivity and multi-channel interfaces across the board.
• Power Supply — Core voltage supply range of 825 mV to 876 mV to match system power-rail planning and regulator design.
• Package & Mounting — 784-BFBGA (784-FCBGA, 23 × 23) surface-mount package for high-density board integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet industrial temperature requirements.
• RoHS Compliant — Conforms to RoHS requirements for restricted substances.

Typical Applications

• Telecommunications Equipment — Implement protocol processing, packet handling, and custom framing logic using the device’s large logic and I/O resources.
• Industrial Control Systems — Use on-chip memory and extensive logic for motion control, real-time data aggregation, and deterministic control tasks in industrial environments.
• Data Acquisition and Processing — Aggregate and preprocess multi-channel sensor or ADC data streams leveraging the abundant logic elements and embedded RAM.

Unique Advantages

• Substantial Logic Density: 355,950 logic elements enable complex algorithms and parallel processing architectures without excessive external components.
• Significant On-Chip Memory: Approximately 31.6 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level routing and BOM.
• High I/O Count: 304 I/Os support broad peripheral interfacing and multiple high-channel interfaces on a single device.
• Industrial Temperature Range: Rated for -40 °C to 100 °C, supporting deployments in demanding environmental conditions.
• Compact BGA Package: 784-FCBGA (23 × 23) provides a high-density footprint for space-constrained designs.
• Defined Core Voltage Window: 825 mV to 876 mV supply specification simplifies power-supply selection and system integration.

Why Choose XCKU3P-2SFVB784I?

The XCKU3P-2SFVB784I balances large programmable logic resources, substantial embedded memory, and a high I/O count within a 784-ball FCBGA package, making it suitable for engineers developing complex digital systems that must operate reliably across industrial temperature ranges. Its specific supply voltage and package details support precise power and board-level design decisions.

This part is appropriate for teams requiring scalable FPGA capacity and on-chip storage for intensive data processing, protocol implementation, or multi-channel interfacing, while maintaining regulatory compliance with RoHS and industrial temperature operation.

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