XCKU3P-3FFVA676E

The XCKU3P-3FFVA676E is a Kintex® UltraScale+™ FPGA from AMD, delivering high logic capacity and substantial embedded memory in a 676-ball FCBGA surface-mount package. This device provides 355,950 logic elements, approximately 31.64 Mbits of on-chip RAM, and 256 user I/O pins, making it suitable for designs that require dense programmable logic, on-chip storage, and significant interface capacity.

Designed for Extended-grade operation, the device supports a supply voltage range of 873 mV to 927 mV and an operating temperature range of 0 °C to 100 °C. RoHS compliance is provided.

Key Features

• Logic Capacity  355,950 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 31.64 Mbits of on-chip RAM for buffering, packet storage, or intermediate data processing.
• I/O Count  256 user I/O pins to support multiple interfaces and parallel connections.
• Power Supply Range  Nominal operating supply voltage from 873 mV to 927 mV to match specified core-power domains.
• Package and Mounting  676-ball FCBGA (27×27) surface-mount package for compact board-level integration.
• Operating Grade and Temperature  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Unique Advantages

• High programmable logic density: 355,950 logic elements enable implementation of substantial custom logic and complex datapaths.
• Ample on-chip RAM: Approximately 31.64 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Generous I/O capability: 256 I/O pins support multi-channel interfacing and parallel connectivity options.
• Compact FCBGA footprint: 676-ball (27×27) FCBGA package supports high-density PCB layouts while remaining surface-mount compatible.
• Extended temperature operation: Rated for 0 °C to 100 °C operation to meet designs requiring extended-grade thermal range.
• Regulatory compliance: RoHS compliance simplifies environmental and materials considerations in product design.

Why Choose XCKU3P-3FFVA676E?

The XCKU3P-3FFVA676E combines large logic capacity, significant embedded memory, and a high I/O count in a compact 676-FCBGA package, making it a practical choice for projects that need on-chip resources and dense interfacing. Its extended-grade temperature rating and defined supply range allow predictable integration into systems with those environmental and power constraints.

This device is suited to customers and designs that require measurable on-chip resources—logic elements, embedded RAM, and I/O—in a surface-mount FCBGA form factor, while retaining RoHS compliance.

Request a quote or submit a pricing and availability inquiry to begin evaluating XCKU3P-3FFVA676E for your design needs.