XCKU3P-L1SFVB784I

The XCKU3P-L1SFVB784I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers programmable logic resources and on-chip memory for complex digital designs.

Featuring approximately 355,950 logic elements, roughly 31.64 Mbits of embedded memory, and 256 I/O pins, this industrial-grade device supports designs that require substantial logic capacity, significant on-chip RAM, and wide operating temperature range.

Key Features

• Core / Logic  Approximately 355,950 logic elements provide a large fabric for implementing custom digital functions and parallel processing pipelines.
• Configurable Logic Blocks (CLBs)  20,340 configurable logic blocks (CLBs) enable fine-grained logic partitioning and resource allocation across your design.
• Embedded Memory  Approximately 31.64 Mbits of on-chip RAM for high-bandwidth buffering, local storage, and fast access to working data.
• I/O  256 I/O pins support broad interfacing options with other system components and peripherals.
• Power  Operates from a core voltage supply range of 698 mV to 876 mV to match specified system power rails.
• Package & Mounting  Delivered in a 784-BFBGA (784-FCBGA, 23×23) surface-mount package for compact board-level integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C suitable for deployed systems with wide thermal requirements.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic density: Approximately 355,950 logic elements enable implementation of complex algorithms and large-scale digital systems on a single device.
• Substantial embedded memory: Roughly 31.64 Mbits of on-chip RAM reduces external memory dependency and improves data locality and throughput.
• Extensive I/O count: 256 I/Os provide flexibility for multi-channel interfaces and broad connectivity to sensors, processors, and peripherals.
• Industrial temperature rating: −40 °C to 100 °C operation supports robust deployments in thermally demanding environments.
• Compact surface-mount package: The 784-FCBGA (23×23) package allows dense PCB layouts while maintaining substantial silicon resources.
• RoHS compliant: Meets common environmental requirements for modern electronic manufacturing.

Why Choose XCKU3P-L1SFVB784I?

The XCKU3P-L1SFVB784I positions itself as a high-capacity, industrial-grade Kintex® UltraScale+™ FPGA tailored for designs that need a balance of logic resources, embedded memory, and I/O density. Its combination of approximately 355,950 logic elements, about 31.64 Mbits of on-chip RAM, and 256 I/Os supports integration of complex digital functions while preserving board-level footprint through a 784-FCBGA surface-mount package.

This device is suited for engineering teams and system designers who require scalable programmable logic with verified industrial temperature performance and RoHS compliance, enabling long-term deployment and integration within a variety of product lines.

Request a quote or submit an availability inquiry for the XCKU3P-L1SFVB784I to receive pricing and lead-time information tailored to your project requirements.