XCKU5P-1FFVA676E
| Part Description |
Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 256 41984000 474600 676-BBGA, FCBGA |
|---|---|
| Quantity | 981 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 256 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 27120 | Number of Logic Elements/Cells | 474600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of XCKU5P-1FFVA676E – Kintex® UltraScale+™ FPGA, 676-FCBGA (27×27)
The XCKU5P-1FFVA676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC configured in a 676-ball FCBGA package. It provides a high logic element count, substantial on-chip RAM, and a 256-pin I/O complement in a surface-mount FCBGA footprint.
This device is offered in an extended grade with an operating temperature range of 0 °C to 100 °C and a documented core supply range of 825 mV to 876 mV, enabling reliable operation within those specified limits.
Key Features
- Core Logic — 27,120 CLBs and 474,600 logic elements (cells) provide significant programmable logic capacity for dense digital designs.
- Embedded Memory — Approximately 42 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
- I/O Count — 256 dedicated I/O pins to support multi-channel interfacing and broad FPGA system connectivity.
- Power Supply — Supported core voltage range from 825 mV to 876 mV for the device's supply requirements.
- Package and Mounting — 676-BBGA / 676-FCBGA package (27×27 mm) in a surface-mount form factor suitable for standard PCB assembly.
- Temperature and Grade — Extended grade device specified for operation from 0 °C to 100 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 474,600 logic elements and 27,120 CLBs enable complex, large-scale FPGA designs without external logic expansion.
- Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- Robust I/O capability: 256 I/O pins provide flexibility for multi-channel interfaces and system integration.
- Compact, assembly-friendly package: 676-FCBGA (27×27) surface-mount package concentrates functionality in a standardized footprint for high-density board layouts.
- Extended operating range: Specified operation from 0 °C to 100 °C and an extended grade designation for designs requiring the stated environmental window.
- Regulatory readiness: RoHS compliance supports use in environments and products where lead-free components are required.
Why Choose XCKU5P-1FFVA676E?
The XCKU5P-1FFVA676E combines a large programmable logic resource, substantial embedded memory, and a broad I/O complement in a single 676-FCBGA package. Its documented supply voltage range and extended temperature rating make it a clear choice where those specific electrical and environmental parameters match design requirements.
This part is suited for engineers and procurement teams seeking an FPGA with high logic element count, notable on-chip RAM capacity, and a compact surface-mount package, while maintaining RoHS compliance and defined operating limits.
Request a quote or contact our sales team to discuss pricing, lead times, and availability for XCKU5P-1FFVA676E.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








