XCKU5P-1FFVD900E

The XCKU5P-1FFVD900E is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, offered in a 900-ball FCBGA package. It delivers high logic density with 474,600 logic elements and approximately 42 Mbits of embedded memory for designs requiring substantial on-chip resources.

Configured for surface-mount assembly and rated for extended-grade operation from 0°C to 100°C, this device provides 304 user I/O and a nominal supply window of 825 mV to 876 mV, making it suitable for applications where dense logic, significant embedded RAM and compact packaging are key considerations.

Key Features

• Core Logic 474,600 logic elements provide high-density programmable fabric for complex digital designs.
• Embedded Memory Approximately 42 Mbits of on-chip RAM to support data buffering, packet processing, or local state storage without external memory.
• I/O Capability 304 user I/O pins available for system interfacing and flexible peripheral connectivity.
• Power Supply Specified operating supply range from 825 mV to 876 mV to match system power architectures.
• Package and Mounting 900-BBGA (900-FCBGA, 31×31) surface-mount package for compact, high-density board layouts.
• Operating Range and Grade Extended-grade temperature range of 0°C to 100°C and RoHS compliance for regulatory alignment.

Unique Advantages

• High integration density: 474,600 logic elements and substantial embedded RAM reduce the need for multiple discrete devices.
• Compact packaging: 900-FCBGA (31×31) package enables space-efficient PCB designs while providing large I/O count.
• Deterministic on-chip resources: Approximately 42 Mbits of RAM allows designers to implement sizeable buffers and localized memory structures without external components.
• Extended operating range: Rated 0°C to 100°C for deployment in systems requiring extended-grade components.
• Regulatory compliance: RoHS-compliant manufacturing supports environmental requirements in commercial products.

Why Choose XCKU5P-1FFVD900E?

The XCKU5P-1FFVD900E balances high logic capacity and on-chip memory with a compact 900-FCBGA package and a wide complement of 304 I/O. Its supply voltage specification and extended-grade temperature rating make it a practical option for designs that require dense programmable logic and substantial embedded RAM in a surface-mount form factor.

For engineering teams and procurement groups seeking a Kintex® UltraScale+™ FPGA with clear, verifiable specifications—logic element count, embedded memory, I/O count, package type, supply range, and operating temperature—this device presents a well-defined option for integration into complex digital systems.

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