XCKU5P-1SFVB784E

The XCKU5P-1SFVB784E is an AMD Kintex® UltraScale+™ Field Programmable Gate Array supplied in a 784-BFBGA (784-FCBGA, 23×23) surface-mount package. It provides a high logic-capacity FPGA fabric with substantial embedded RAM and a large I/O count for complex, resource‑intensive designs.

Key on-chip resources include 474,600 logic elements, approximately 42 Mbits of embedded memory (41,984,000 bits), and 304 general-purpose I/O pins. The device is an extended-grade part with a specified operating temperature range of 0 °C to 100 °C and a core voltage supply range of 825 mV to 876 mV.

Key Features

• Core Logic  474,600 logic elements provide ample capacity for large-scale digital designs and custom logic implementations.
• Configurable Logic Blocks (CLBs)  27,120 CLBs for structured logic partitioning and resource planning.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM (41,984,000 bits) to support buffering, FIFOs, and memory‑intensive functions.
• I/O Resources  304 I/O pins support multi-channel interfacing and high pin-count connectivity in a single device.
• Power and Voltage  Specified core voltage supply range from 825 mV to 876 mV for predictable power planning and board design.
• Package and Mounting  784-BFBGA (supplier package: 784-FCBGA, 23×23) in a surface-mount package suitable for compact PCB integration.
• Operating Conditions  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• FPGA-based compute acceleration  Use the large logic element count and embedded memory to implement hardware-accelerated algorithms and custom datapaths.
• High‑I/O aggregation  304 I/O pins enable designs that consolidate multiple interfaces or high-channel-count front-ends on a single FPGA.
• Memory-centric buffering and processing  Approximately 42 Mbits of on-chip RAM supports data buffering, streaming, and intermediate storage within complex pipelines.

Unique Advantages

• High logic capacity: 474,600 logic elements allow implementation of large and complex logic designs without immediate partitioning across multiple devices.
• Ample embedded memory: Approximately 42 Mbits of on-chip RAM reduces dependence on external memory for many buffering and intermediate storage needs.
• Generous I/O count: 304 I/O pins simplify integration of multiple interfaces and high-channel-count systems on a single FPGA.
• Compact BGA package: 784-FCBGA (23×23) package provides a high-density solution for space‑constrained PCBs while maintaining extensive device resources.
• Controlled supply range: Narrow voltage supply window (825 mV–876 mV) supports consistent power planning and predictable core behavior.
• Extended-grade operation: Rated for 0 °C to 100 °C operating range to meet a range of commercial and extended-environment applications.

Why Choose XCKU5P-1SFVB784E?

The XCKU5P-1SFVB784E combines substantial logic resources, significant embedded memory, and a high I/O count in a compact 784-FCBGA surface-mount package. Its extended-grade rating and defined core voltage window make it a suitable option for engineering teams designing complex systems that require integrated logic capacity and on-chip storage.

This device is well suited to designers seeking a single‑chip solution for dense logic implementations, high-channel interfacing, and memory‑heavy processing, offering predictable electrical and thermal parameters for board-level integration and system planning.

Request a quote or contact sales to discuss availability, pricing, and how the XCKU5P-1SFVB784E can fit into your next design.