XCKU5P-1SFVB784I

The XCKU5P-1SFVB784I is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD, supplied in a 784-FCBGA (23×23) surface-mount package. It provides a high logic element count and substantial on-chip memory while supporting industrial-grade operating temperatures and a defined core voltage range.

Designed for systems that require significant programmable logic, embedded memory, and flexible I/O, this device is well suited to industrial applications where temperature range and packaging density are important considerations.

Key Features

• Core Logic  Approximately 474,600 logic elements for implementing complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, caching, and memory-intensive logic blocks.
• I/O Count  304 user I/O pins to accommodate multiple high-density interfaces and peripheral connections.
• Power Supply  Specified core voltage range from 825 mV to 876 mV for predictable power budgeting and design integration.
• Package & Mounting  784-FCBGA (23×23) package in a surface-mount form factor for compact board-level integration.
• Operating Temperature  Industrial-grade rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Control & Automation  Use the device’s substantial logic capacity and wide operating temperature range to implement control algorithms, motor control logic, and real-time processing in industrial environments.
• Communications Infrastructure  Leverage high logic density and on-chip memory for packet processing, protocol handling, and interface bridging in networking equipment.
• Signal Processing  Deploy the FPGA’s logic elements and embedded RAM for high-throughput digital signal processing, filtering, and data buffering tasks.

Unique Advantages

• High Logic Density: Approximately 474,600 logic elements enable complex, multi-function designs on a single device, reducing system-level component count.
• Significant Embedded Memory: Around 42 Mbits of on-chip RAM supports local buffering and reduces dependence on external memory for many designs.
• Generous I/O Capacity: 304 I/O pins provide flexibility for interfacing to multiple peripherals and high-speed links.
• Industrial Temperature Rating: −40 °C to 100 °C operation addresses the needs of temperature-challenging deployments.
• Compact FCBGA Packaging: 784-FCBGA (23×23) surface-mount package enables dense PCB layouts while maintaining a high integration level.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XCKU5P-1SFVB784I?

The XCKU5P-1SFVB784I positions itself as a high-capacity FPGA option for industrial designs that require a combination of extensive programmable logic, embedded memory, and a robust operating temperature range. Its 474,600 logic elements and approximately 42 Mbits of on-chip RAM make it suitable for complex signal processing, protocol handling, and control applications where integration and board density matter.

Backed by AMD’s Kintex® UltraScale+™ family lineage, this device is aimed at engineers and procurement teams building scalable, high-density FPGA-based solutions that must operate reliably across a wide temperature range and meet RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU5P-1SFVB784I. Our team can provide technical and procurement support to help evaluate this FPGA for your design.