XCKU5P-2FFVA676E

The XCKU5P-2FFVA676E is a Kintex® UltraScale+™ field programmable gate array (FPGA) supplied in a 676-FCBGA (27×27) surface-mount package. It provides a large programmable fabric with 474,600 logic elements, approximately 42 Mbits of embedded memory, and 256 general-purpose I/O pins.

Designed for applications that require substantial on-chip logic, memory and I/O capacity, this extended‑grade, RoHS‑compliant device operates from 0 °C to 100 °C and accepts a core voltage supply between 825 mV and 876 mV.

Key Features

• Programmable Logic 474,600 logic elements to implement complex custom digital logic and state machines.
• Embedded Memory Approximately 42 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• I/O Capacity 256 I/O pins providing flexible connectivity to external peripherals and interfaces.
• Power Supply Core voltage range of 825 mV to 876 mV to match system power rails.
• Package & Mounting 676‑FBG A FCBGA package (27×27) in a surface‑mount format for compact board-level integration.
• Temperature & Grade Extended grade operation from 0 °C to 100 °C for a range of commercial and higher‑temperature environments.
• Environmental RoHS compliant construction to meet lead‑free assembly requirements.

Typical Applications

• Custom digital processing Implement application‑specific datapaths and control logic using the device's large logic and memory resources.
• Prototyping and evaluation platforms Deploy complex designs that require significant on‑chip resources during development and validation.
• High‑density I/O interfacing Support multiple parallel interfaces or mixed signal front ends with 256 available I/O pins.

Unique Advantages

• High logic density: 474,600 logic elements enable sizable custom designs without immediate need for external programmable logic.
• Substantial on‑chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
• Generous I/O count: 256 I/O pins provide flexibility for interfacing to peripherals, sensors, and parallel buses.
• Compact, surface‑mount package: 676‑FCBGA (27×27) offers a space-efficient footprint for dense board layouts.
• Extended temperature range: Rated for 0 °C to 100 °C operation to accommodate a variety of deployment environments.
• Regulatory compliance: RoHS compliant for lead‑free manufacturing and assembly processes.

Why Choose XCKU5P-2FFVA676E?

The XCKU5P-2FFVA676E positions itself as a high‑capacity Kintex UltraScale+ FPGA option for designs that require extensive programmable logic, embedded memory, and substantial I/O in a compact surface‑mount form factor. Its extended temperature rating and controlled core voltage range make it suitable for applications that must balance density and thermal considerations.

This device is appropriate for developers and teams building feature‑rich, scalable digital systems who need on‑chip resources to minimize external components and simplify board design while maintaining RoHS compliance.

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