XCKU5P-1FFVD900I

The XCKU5P-1FFVD900I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) optimized for high-density, industrial-grade designs. It integrates 474,600 logic elements and approximately 42 Mbits of embedded memory to support complex programmable logic and data buffering on a single device. With 304 user I/Os, a 900‑ball FCBGA package (31×31), and an industrial operating range, this device is suited to demanding embedded and industrial applications that require substantial on-chip resources and robust thermal performance.

Key Features

• Logic Capacity  Provides 474,600 logic elements to implement large-scale digital designs and custom processing pipelines.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM for data buffering, FIFOs, and local storage for high-throughput designs.
• I/O Resources  304 user I/Os available for wide interfacing options with external devices, mezzanines, or daughter cards.
• Power and Core Voltage  Core voltage range specified at 0.825 V to 0.876 V to match system power-rail planning and PSD considerations.
• Package and Mounting  900‑ball FCBGA (31×31) surface-mount package for high-density board integration and controlled footprint.
• Temperature and Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for reliable operation in harsh environments.
• Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Automation and Control  Leverage industrial temperature rating, large logic capacity, and plentiful I/Os to implement motion control, motor drives, and factory automation logic.
• Embedded Signal Processing  Use the device’s high logic density and embedded memory for real-time data processing, filtering, and protocol handling in measurement and instrumentation systems.
• Communications and Networking Equipment  Deploy the FPGA for packet processing, protocol bridging, and custom interface logic where high I/O count and on-chip memory are required.

Unique Advantages

• High Logic Density:  474,600 logic elements enable consolidation of multiple functions onto a single FPGA, reducing BOM complexity.
• Substantial On-Chip RAM:  Approximately 42 Mbits of embedded memory supports large buffers and low-latency data paths without external DRAM.
• Robust Industrial Operation:  Rated for -40 °C to 100 °C operation, suitable for industrial environments that impose wide thermal ranges.
• Generous I/O Count:  304 user I/Os provide flexible connectivity for dense front-end interfaces and board-level routing choices.
• Compact High-Density Package:  900‑ball FCBGA (31×31) delivers a compact footprint for space-constrained designs while supporting high pin counts.
• Environmentally Compliant:  RoHS-compliant construction aligns with global manufacturing and end-product requirements.

Why Choose XCKU5P-1FFVD900I?

The XCKU5P-1FFVD900I positions itself as a high-capacity, industrial-grade FPGA option for designers who need extensive programmable logic, significant embedded memory, and a broad I/O set in a compact FCBGA package. Its specified core voltage range and RoHS compliance simplify system power planning and manufacturing alignment.

This device is well suited to engineering teams building scalable, long-lived embedded systems—particularly where thermal resilience, on-chip resources, and dense I/O count are primary considerations. It provides a balanced combination of logic capacity, memory, and package density to support complex, integrated designs.

Request a quote or submit a sales inquiry today to evaluate how the XCKU5P-1FFVD900I can meet your project requirements and to obtain pricing and availability information.