XCKU5P-1FFVB676I

The XCKU5P-1FFVB676I is a Kintex® UltraScale+™ field programmable gate array from AMD, delivered in a 676-FCBGA (27×27) surface-mount package. It provides a high logic capacity FPGA fabric together with substantial on-chip memory and a broad set of I/O for industrial applications.

With 474,600 logic elements, approximately 42 Mbits of embedded memory and 280 I/Os, this device is aimed at industrial designs that require programmable logic density, significant embedded RAM, and a compact package while operating across an extended temperature range.

Key Features

• Core & Logic  Provides 474,600 logic elements for implementing large-scale custom logic and advanced digital functions.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffer, cache and intermediate processing storage without immediate dependence on external memory.
• I/O Capacity  280 programmable I/O pins to interface with sensors, peripherals and external subsystems.
• Power  Operates from a core supply range of 825 mV to 876 mV, suitable for designs targeting low-voltage core operation.
• Package & Mounting  676-BBGA, FCBGA package (supplier device package: 676-FCBGA (27×27)) in a surface-mount form factor for compact board integration.
• Temperature & Grade  Industrial grade rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Programmable logic and abundant I/O make this device suitable for motor control, PLC interfaces and industrial automation functions that require robust operation over an extended temperature range.
• High-density Digital Processing  Large logic element count and on-chip RAM support signal processing, data aggregation and custom pipeline implementations.
• Embedded Compute Platforms  Use as the programmable core in embedded systems that require customizable logic, local memory and multiple I/O interfaces.
• Prototyping and Development  Well suited for developing and validating complex digital designs that will move into production in industrial environments.

Unique Advantages

• High Logic Capacity: 474,600 logic elements enable implementation of large, complex digital designs without partitioning across multiple devices.
• Significant On-chip Memory: Approximately 42 Mbits of embedded RAM reduce reliance on external memory for many buffering and caching needs.
• Ample I/O: 280 I/Os provide flexible connectivity for sensors, peripherals and external interfaces, simplifying board-level routing and integration.
• Industrial-grade Operation: Rated from −40 °C to 100 °C for reliability in extended-temperature industrial deployments.
• Compact Surface-mount Package: 676-FCBGA (27×27) package provides a dense footprint for space-constrained designs.
• Low-voltage Core Supply: Core supply range of 825 mV to 876 mV supports low-voltage FPGA implementations.

Why Choose XCKU5P-1FFVB676I?

The XCKU5P-1FFVB676I positions itself as a high-capacity, industrial-grade Kintex UltraScale+ FPGA option for designs that require sizable programmable logic, substantial embedded memory and robust I/O in a compact surface-mount package. Its specifications align with projects that need deterministic operation across an extended temperature range and a dense integration of logic and memory on-chip.

This part is suitable for teams developing complex embedded systems, industrial automation equipment, or high-density digital processing applications that benefit from on-chip resources and a compact FCBGA footprint.

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