XCKU3P-L2SFVB784E

The XCKU3P-L2SFVB784E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) offering a high-density programmable logic fabric in a 784-FCBGA (23×23) surface-mount package. It provides a large pool of logic elements, substantial on-chip RAM, and a broad I/O count for designs that require dense integration and flexible interfacing.

With an extended operating temperature range and a low voltage supply window, this device is aimed at applications that need a combination of logic capacity, embedded memory, and controlled power characteristics.

Key Features

• Logic Capacity  Provides 355,950 logic elements to implement complex custom logic, datapaths, and control functions.
• Embedded Memory  Approximately 31.64 Mbits of on-chip RAM for buffering, lookup tables, and local storage close to logic.
• I/O Density  256 I/O pins to support multiple parallel interfaces, peripheral connections, and board-level routing options.
• Package & Mounting  784-FCBGA package (23×23) in a surface-mount BGA form factor for compact board integration and high pin density.
• Voltage Supply  Operates with a supply range from 698 mV to 876 mV, supporting designs with tight core-voltage requirements.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring a wider-than-commercial temperature envelope.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• High-density logic systems  Use the large logic element count to implement complex control, packet processing, or custom compute pipelines.
• Memory-centric functions  Leverage approximately 31.64 Mbits of embedded RAM for buffering, frame storage, or lookup-intensive algorithms.
• Multi-interface platforms  Support numerous parallel interfaces and peripherals using the 256 available I/O pins for flexible board-level connectivity.

Unique Advantages

• High logic density: 355,950 logic elements enable implementation of large-scale logic and algorithmic blocks without external programmable devices.
• Substantial on-chip RAM: Approximately 31.64 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Generous I/O count: 256 I/Os simplify interfacing to multiple subsystems and peripherals on complex PCBs.
• Compact, high-pin-count package: 784-FCBGA (23×23) offers a space-efficient footprint with high routing density for advanced board layouts.
• Controlled power window: Operating voltage from 698 mV to 876 mV supports designs targeting low-voltage core rails.
• Extended temperature capability: Operation from 0 °C to 100 °C provides margin for applications requiring an extended ambient range.

Why Choose XCKU3P-L2SFVB784E?

The XCKU3P-L2SFVB784E combines a large logic resource pool, significant embedded RAM, and a high I/O count in a compact 784-FCBGA package, making it suitable for designs that require dense programmable logic and on-chip memory. Its extended-grade temperature range and RoHS compliance align with applications that need reliable operation across a broader ambient range and a compliant manufacturing profile.

This device is well suited to engineers and system designers building complex digital systems that demand integrated memory, flexible interfacing, and a compact board footprint while maintaining controlled power characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU3P-L2SFVB784E and to discuss how it fits your design requirements.