XCKU3P-L1FFVD900I

The XCKU3P-L1FFVD900I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD designed for applications that require high logic density and substantial on-chip memory. It integrates a large number of logic elements, significant embedded RAM capacity, and a 304-pin I/O complement in a 900-ball FCBGA package for compact, board-level integration.

This device is specified for industrial-grade operation with a wide operating temperature range and RoHS compliance, making it suitable for systems that demand reliable operation across extended environmental conditions.

Key Features

• Core logic  355,950 logic elements provide high logic density for complex digital designs and large-scale hardware acceleration.
• Embedded memory  Approximately 31.6 Mbits of on-chip RAM to support buffering, caching, and intermediate data storage.
• I/O capability  304 user I/O pins to interface with external devices, sensors, and peripherals.
• Package and mounting  900-ball FCBGA package (900-BBGA, supplier package 900-FCBGA 31×31) designed for surface-mount PCB assembly while minimizing board footprint.
• Power supply  Core supply range specified from 698 mV to 876 mV to match targeted system power architectures.
• Environmental and grade  Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory compatibility.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded RAM for complex signal processing, data path acceleration, and algorithm offload.
• I/O-rich control systems  Take advantage of 304 I/O pins for systems that require extensive peripheral, sensor, or actuator interfaces.
• Compact board-level designs  The 900-FCBGA package and surface-mount mounting enable space-constrained PCBs where high integration is required.
• Industrial applications  The −40 °C to 100 °C operating range and industrial grade make the device suitable for equipment that operates across wide temperature ranges.

Unique Advantages

• High logic capacity: 355,950 logic elements support complex designs and substantial parallelism without external logic expansion.
• Substantial embedded memory: Approximately 31.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching tasks.
• Generous I/O count: 304 I/O pins simplify integration with multiple peripherals and signal interfaces, reducing the need for external multiplexing.
• Industrial-ready thermal range: Specified operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Compact, board-friendly package: 900-ball FCBGA (31×31) supports dense, low-profile PCB layouts while retaining high pin count.
• Regulatory compliance: RoHS status marked as compliant to meet common environmental requirements.

Why Choose XCKU3P-L1FFVD900I?

The XCKU3P-L1FFVD900I delivers a balance of high logic density, on-chip memory, and broad I/O capability in a compact FCBGA package, positioned for designs that require substantial programmable resources and reliable operation across industrial temperature ranges. Its defined supply and thermal specifications make it a practical choice for engineers building complex digital systems where board space, integration, and environmental tolerance are key considerations.

Designed as part of the Kintex® UltraScale+™ family from AMD, this FPGA is suited to customers developing compute- and I/O-intensive applications who need verifiable device-level specifications for system design and procurement.

Request a quote or submit a sales inquiry to check pricing and availability for the XCKU3P-L1FFVD900I and to get assistance matching device quantities and delivery to your project timeline.