XCKU3P-L1FFVB676I

The XCKU3P-L1FFVB676I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC supplied in a 676‑FCBGA (27×27) package. Designed for applications requiring high logic density and substantial embedded memory, this industrial‑grade device delivers a balance of programmable logic, on‑chip RAM, and I/O capacity in a surface‑mount form factor.

Key Features

• Programmable Logic Approximately 355,950 logic elements provide extensive programmable resources for implementing custom logic, datapaths, and state machines.
• Embedded Memory Approximately 31.6 Mbits of on‑chip RAM to support buffering, packet storage, and local data processing without external memory.
• I/O Capacity 280 user I/Os to support a wide range of parallel interfaces, bus connections, and peripheral signals.
• Power Supply Operating supply range from 698 mV to 876 mV, suitable for architectures expecting low‑voltage core operation.
• Package & Mounting 676‑pad FCBGA (27×27) package in a surface‑mount format to accommodate compact, high‑pin‑count board designs.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• High‑density logic systems Implement complex custom logic and algorithms using the device’s large pool of logic elements and embedded RAM.
• Data buffering and packet processing Leverage approximately 31.6 Mbits of on‑chip RAM for local buffering and intermediate data storage.
• Multi‑interface designs Use up to 280 I/Os to connect parallel buses, peripherals, and external subsystems in compact board layouts.

Unique Advantages

• High logic density: Approximately 355,950 logic elements enable implementation of large finite state machines, datapaths, and custom accelerators without immediate need for external programmable logic.
• Substantial on‑chip memory: About 31.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and local‑storage needs.
• Significant I/O resources: 280 I/Os simplify integration with multiple peripherals, sensors, and external interfaces while keeping board complexity manageable.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliability in temperature‑sensitive or harsh operating environments.
• Compact, high‑pin package: 676‑FCBGA (27×27) footprint delivers high connectivity in a space‑efficient surface‑mount package.
• RoHS compliance: Environmentally compliant for designs requiring lead‑free manufacturing standards.

Why Choose XCKU3P-L1FFVB676I?

The XCKU3P-L1FFVB676I positions itself as a robust, industrial‑grade FPGA option where significant programmable logic, on‑chip memory, and I/O density are required in a compact surface‑mount package. Its combination of approximately 355,950 logic elements, roughly 31.6 Mbits of embedded RAM, and 280 I/Os supports a wide range of complex, memory‑intensive, and I/O‑rich designs.

This device is suited for engineering teams and procurement organizations seeking a scalable FPGA building block that balances integration density, operating temperature tolerance, and regulatory compliance for long‑lifecycle products and industrial applications.

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