XCKU3P-3FFVB676E

The XCKU3P-3FFVB676E is a Kintex® UltraScale+™ field programmable gate array (FPGA) in a 676-ball FCBGA package (27×27). It delivers a large programmable fabric with substantial on-chip RAM and a broad I/O count for complex digital designs.

Key attributes include 355,950 logic elements, approximately 31.6 Mbits of embedded memory, 280 general I/O pins, and operation across an extended temperature range with a surface-mount 676-FCBGA package.

Key Features

• Logic Capacity  355,950 logic elements provide substantial programmable fabric for implementing complex logic and custom processing blocks.
• Configurable Logic Blocks  20,340 logic blocks support modular design partitioning and hierarchical implementation.
• On-Chip Memory  Approximately 31.6 Mbits of embedded RAM for frame buffering, lookup tables, and intermediate data storage.
• I/O  280 user I/O pins suitable for interfacing with peripherals, buses, and external components.
• Power Supply  Supported core supply range of 0.873 V to 0.927 V to match system power-rail requirements.
• Package & Mounting  676-BBGA / 676-FCBGA (27×27) surface-mount package for high-density board layouts.
• Temperature Range  Extended-grade operation from 0 °C to 100 °C for use in a wide range of environmental conditions.
• Compliance  RoHS compliant, enabling use in assemblies that require lead-free components.

Unique Advantages

• High logic density: The large logic element count supports complex, resource-intensive designs without immediate platform changes.
• Substantial embedded memory: Approximately 31.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching tasks.
• Generous I/O availability: 280 I/O pins allow flexible interfacing to multiple peripherals and parallel buses, simplifying board-level design.
• Compact, high-density package: The 676-FCBGA (27×27) package enables dense PCB layouts while maintaining a ball-grid routing footprint.
• Extended operating range: 0 °C to 100 °C operation supports deployments in thermally varied environments.
• RoHS compliance: Contributes to regulatory and assembly process compliance for lead-free manufacturing.

Why Choose XCKU3P-3FFVB676E?

The XCKU3P-3FFVB676E balances high logic capacity, significant on-chip memory, and a wide complement of I/O in a compact 676-FCBGA package. Its extended temperature rating and RoHS compliance make it suitable for designs that require reliable programmable logic and memory resources within constrained board space.

This device is well suited for engineering teams seeking a scalable FPGA platform that provides sizeable fabric and embedded RAM while supporting dense, surface-mount board layouts. The combination of logic elements, memory, and I/O helps simplify system architecture and reduce external component counts.

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