XCKU3P-2FFVD900I

The XCKU3P-2FFVD900I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density programmable logic resource set with 355,950 logic elements and approximately 31.64 Mbits of embedded memory in a 900-FCBGA package.

Designed for applications that require substantial on-chip logic, memory and I/O capacity, this industrial-grade device supports a wide operating temperature range and a defined supply voltage window for controlled-power designs.

Key Features

• Logic Capacity — 355,950 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 31.64 Mbits of on-chip RAM for buffering, data storage and state retention.
• I/O Count — 304 general-purpose I/O pins to interface with peripherals, sensors and high-density connectors.
• Package & Mounting — 900-FCBGA (31×31) supplier device package in a surface-mount form factor, optimized for compact board integration.
• Power Supply — Voltage supply range of 825 mV to 876 mV to match defined core power domains.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance — Lead-free and RoHS-compliant construction for regulatory and manufacturing compatibility.

Unique Advantages

• High logic density: 355,950 logic elements enable complex programmable implementations without external logic expansion.
• Substantial on-chip memory: Approximately 31.64 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• Generous I/O resources: 304 I/Os provide flexibility for multi-channel interfaces and high-pin-count connectivity.
• Industrial temperature capability: Rated from −40 °C to 100 °C for use in temperature-demanding installations.
• Compact, manufacturable package: 900-FCBGA (31×31) surface-mount package supports high-density board layouts and automated assembly.
• Defined core voltage window: Narrow voltage supply range (825 mV–876 mV) supports predictable power design and thermal planning.

Why Choose XCKU3P-2FFVD900I?

The XCKU3P-2FFVD900I combines a large pool of logic elements, substantial embedded memory and a high I/O count in a single industrial-grade FPGA package, making it suitable for designs that require on-chip integration of complex digital functions. Its defined voltage supply range and wide operating temperature span aid in predictable power and thermal management.

This device is well suited to development teams and procurement groups seeking a high-capacity, RoHS-compliant FPGA in a compact 900-FCBGA surface-mount package, offering a balance of performance, integration and environmental range for long-term deployments.

Request a quote or submit a sales inquiry to receive pricing, availability and further technical support for the XCKU3P-2FFVD900I.