XCKU3P-2FFVD900E

The XCKU3P-2FFVD900E is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD supplied in a 900‑ball FCBGA package. It delivers high logic density, substantial on-chip memory, and a large I/O count for designs that require programmable hardware resources in a compact surface‑mount form factor.

With approximately 355,950 logic elements, about 31.6 Mbits of embedded memory and up to 304 I/O, this device targets applications that need extensive programmable logic, embedded storage, and reliable I/O connectivity while operating within a defined supply and temperature window.

Key Features

• Core Logic  Contains approximately 355,950 logic elements and 20,340 CLBs for implementing large, complex programmable logic designs.
• Embedded Memory  Provides approximately 31.6 Mbits of on‑chip RAM for buffering, data staging and local storage of intermediate results.
• I/O Capacity  Up to 304 general‑purpose I/O pins support substantial peripheral and system interfacing in a single device.
• Power Supply  Core voltage supply range is specified between 825 mV and 876 mV, enabling operation within the device’s defined low‑voltage core range.
• Package & Mounting  Supplied in a 900‑BBGA FCBGA package (900‑FCBGA, 31×31) optimized for surface‑mount PCB assembly and high‑density board layouts.
• Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications within that thermal envelope.
• Environmental Compliance  RoHS compliant construction supports regulatory requirements for lead‑free assembly.

Typical Applications

• Compute Acceleration  Implement custom data‑path logic and hardware accelerators using the device’s large logic element count and on‑chip memory.
• High‑Density I/O and Protocol Bridging  Leverage 304 I/O in the 900‑ball FCBGA package to consolidate multiple interfaces and perform protocol conversion in a compact footprint.
• System Prototyping and Integration  Use reprogrammable logic and embedded RAM to validate system architectures and integrate complex functions on a single chip.

Unique Advantages

• High Logic Density: Approximately 355,950 logic elements enable integration of complex, multi‑block designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: About 31.6 Mbits of embedded RAM reduce dependence on external memory for many buffering and staging tasks.
• Large I/O Count in a Compact Package: 304 I/O in a 900‑FCBGA (31×31) footprint supports rich external connectivity while maintaining a small PCB area.
• Defined Low‑Voltage Core Supply: Core operation between 825 mV and 876 mV supports designs targeting modern low‑voltage logic domains.
• Extended Grade and RoHS Compliance: Extended grade temperature rating and RoHS compliance provide clear environmental and thermal characteristics for deployment planning.

Why Choose XCKU3P-2FFVD900E?

The XCKU3P-2FFVD900E positions itself as a high‑density, highly configurable FPGA solution for engineers who need significant programmable logic, embedded memory and a large number of I/O in a single surface‑mount package. Its combination of approximately 355,950 logic elements, roughly 31.6 Mbits of RAM and 304 I/O pins makes it suitable for consolidating complex functions and accelerating custom processing workloads.

Backed by AMD as the manufacturer and supported by UltraScale+ family documentation, this device is appropriate for teams seeking scalable FPGA resources with defined electrical, thermal and packaging characteristics to plan board‑level integration and procurement.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the XCKU3P-2FFVD900E. Provide your quantity and requirements to receive a tailored response.