XCKU3P-2FFVA676I

The XCKU3P-2FFVA676I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. It provides a high-density programmable fabric with 355,950 logic elements and approximately 31.6 Mbits of embedded memory for complex digital designs.

Targeted for industrial applications, this surface-mount device features 256 user I/O, a core voltage supply range of 825 mV to 876 mV, and an operating temperature range of -40 °C to 100 °C. It is delivered in a 676-FCBGA (27×27) package and is RoHS compliant.

Key Features

• Core Logic 355,950 logic elements provide a large programmable fabric for high-density designs and complex logic implementations.
• Embedded Memory Approximately 31.6 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for compute and signal processing tasks.
• I/O Count 256 user I/O pins to interface with peripherals, sensors, and external devices in board-level systems.
• Low-Voltage Core Core supply specified from 825 mV to 876 mV for designs targeting modern low-voltage power domains.
• Package and Mounting 676-FCBGA (27×27) package in a surface-mount form factor to support compact, high-density PCB layouts.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C for deployment in temperature-demanding industrial environments.
• Compliance RoHS compliant to meet common environmental and materials requirements.

Typical Applications

• High-density logic designs — Suited for implementations that require hundreds of thousands of logic elements and substantial on-chip memory for custom digital functions.
• Industrial control and automation — Industrial-grade rating and extended temperature range make it a fit for control systems, PLC extensions, and factory automation interfaces.
• Embedded signal processing — Large logic capacity and embedded RAM enable buffering and local processing for real-time data handling and algorithm acceleration.

Unique Advantages

• High logic capacity: 355,950 logic elements enable complex, multi-function designs without immediate need to partition across devices.
• Substantial on-chip memory: Approximately 31.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path needs.
• Robust industrial rating: -40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
• Compact ball grid package: 676-FCBGA (27×27) package allows dense PCB integration while providing ample I/O in a single device.
• Low-voltage core operation: 825–876 mV supply range aligns with modern board power architectures and supports power-conscious designs.
• RoHS compliance: Meets common materials and environmental requirements for commercial and industrial product lines.

Why Choose XCKU3P-2FFVA676I?

The XCKU3P-2FFVA676I positions itself as a high-density, industrial-grade FPGA option for designs that demand large logic capacity, significant embedded memory, and reliable operation across a wide temperature range. Its combination of logic elements, RAM, and 256 I/O pins makes it suitable for system designs that consolidate multiple functions into a single programmable device.

For engineering teams building industrial automation, embedded processing, or complex logic-intensive systems, this device offers a balance of integration and environmental robustness that supports scalable designs and long-term deployment.

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