XCKU3P-2FFVB676E

The XCKU3P-2FFVB676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC offering high logic capacity and substantial on-chip memory in a compact BGA package. It integrates 355,950 logic elements, approximately 31.64 Mbits of embedded memory, and 280 I/O to support complex, memory‑aware designs.

Packaged as a 676-FCBGA (27x27) surface-mount device with extended-grade operation and a defined supply voltage range, this FPGA is suitable for board-level integration where logic density, embedded RAM, and I/O count are primary design drivers.

Key Features

• Logic Capacity  Provides 355,950 logic elements to implement large-scale digital logic and custom processing functions on a single device.
• Embedded Memory  Approximately 31.64 Mbits of on-chip RAM for buffering, state storage, and data-path implementations without external memory.
• I/O Resources  280 device I/O pins to support a broad set of peripheral and interface connections on the board.
• Package & Mounting  Delivered in a 676-FCBGA (27x27) package and intended for surface-mount assembly to enable compact PCB layouts.
• Power Supply  Operates from a defined core supply range of 825 mV to 876 mV for predictable power planning and regulation.
• Operating Grade & Temperature  Extended-grade device rated for operation from 0°C to 100°C to match designs targeting constrained commercial temperature ranges.
• Regulatory  RoHS-compliant for adherence to common materials and environmental requirements.

Typical Applications

• High-density logic designs  Targets implementations that require hundreds of thousands of logic elements for consolidated digital functions.
• Memory-centric processing  Suitable for designs that rely on significant on-chip RAM for buffering, lookup tables, or data-path storage.
• I/O‑rich board designs  Appropriate for systems needing a large number of external interfaces, leveraging 280 available I/O pins.
• Compact PCB solutions  Surface-mount 676-FCBGA packaging supports high-density board layouts where board space is a consideration.

Unique Advantages

• Substantial logic resources: 355,950 logic elements enable integration of complex functions and reduce the need for multiple discrete devices.
• Significant on-chip memory: Approximately 31.64 Mbits of embedded RAM simplifies designs that require local buffering and fast data access.
• High I/O count: 280 I/O pins provide flexibility for interfacing with numerous peripherals and parallel data channels.
• Standard surface-mount package: 676-FCBGA (27x27) supports compact, manufacturable board designs and standard PCB assembly flows.
• Defined power envelope: Core supply range of 825 mV to 876 mV assists in precise power supply design and thermal planning.
• Extended-grade operation: Rated for 0°C to 100°C operation to meet common commercial extended-temperature deployment scenarios.

Why Choose XCKU3P-2FFVB676E?

The XCKU3P-2FFVB676E positions itself for designs that require a balance of high logic density, substantial embedded memory, and a generous I/O count in a compact surface-mount package. Its defined supply range and extended operating temperature make it suitable for board-level systems where predictable electrical and thermal characteristics are important.

This device is a fit for teams integrating large-scale digital logic and on-chip data storage into a single FPGA to streamline system architecture, reduce external component count, and simplify PCB layout considerations.

Request a quote or submit your requirements to our sales team to discuss availability, volume pricing, and lead times for the XCKU3P-2FFVB676E.