XCKU3P-1SFVB784E

The XCKU3P-1SFVB784E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for implementable, high-density digital logic. It delivers a large pool of programmable logic resources and embedded memory in a compact 784-ball FCBGA package.

This device is suitable for designs that require substantial on-chip logic capacity, significant embedded RAM, and a high number of I/O signals within an extended temperature range.

Key Features

• Logic Capacity  Approximately 355,950 logic elements for implementing complex, high-density digital logic.
• Embedded Memory  Approximately 31.6 Mbits of on-chip RAM to support buffer, cache, and intermediate data storage.
• I/O Count  304 user I/O pins to support broad connectivity and interface requirements.
• Package  784-BFBGA (784-FCBGA, 23×23) ball-grid package that provides a compact surface-mount footprint for board-level integration.
• Power  Core voltage range specified from 825 mV to 876 mV for core supply planning and power budgeting.
• Temperature & Grade  Extended grade device rated for operation from 0 °C to 100 °C.
• Mounting  Surface mount package suitable for standard PCB assembly processes.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High-density digital processing  Implement custom logic and datapaths that require a large logic element count.
• Memory-intensive functions  Designs needing substantial on-chip RAM for buffering, lookup tables, or intermediate data storage.
• Multi-interface systems  Applications that require many I/Os for connecting multiple peripherals, sensors, or external devices.

Unique Advantages

• High logic capacity: Approximately 355,950 logic elements enable complex digital designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 31.6 Mbits of embedded RAM reduces reliance on external memory for moderate buffering and working datasets.
• Generous I/O availability: 304 I/O pins provide flexibility for diverse interface and connectivity requirements.
• Compact BGA package: 784-ball FCBGA (23×23) offers a high-density solution for space-constrained PCBs.
• Predictable core power window: Core supply range of 825 mV to 876 mV allows precise power-supply design and planning.
• Extended temperature operation: Rated for 0 °C to 100 °C to support a broad set of environmental conditions.

Why Choose XCKU3P-1SFVB784E?

The XCKU3P-1SFVB784E combines a large pool of logic elements, significant embedded memory, and a high I/O count in a single 784-ball FCBGA package, making it a practical choice for complex digital designs that require integration and density. Its defined core voltage range and extended temperature rating help engineers plan power and thermal solutions with clarity.

This device is well suited for developers and procurement teams targeting scalable, high-capacity FPGA implementations where board space, on-chip resources, and predictable operating conditions are priorities.

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