XCKU3P-1FFVD900E

The XCKU3P-1FFVD900E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) provided in a 900-ball FCBGA package. It delivers a high-density programmable logic fabric paired with substantial on-chip memory and a broad I/O complement for demanding digital designs.

Designed for applications that require significant logic resources and embedded memory, this device combines 355,950 logic elements, approximately 31.6 Mbits of embedded memory, and 304 I/O pins in a surface-mount 900-FCBGA (31×31) package. The device operates over a core voltage range of 825 mV to 876 mV and an operating temperature range of 0°C to 100°C.

Key Features

• Core Architecture  Kintex® UltraScale+™ Field Programmable Gate Array family—programmable logic fabric for custom digital implementations.
• Logic Capacity  Approximately 355,950 logic elements enabling implementation of complex logic, control, and datapath structures.
• Embedded Memory  Approximately 31.6 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O and Package  304 user I/O pins in a 900-FCBGA surface-mount package; supplier device package specified as 900-FCBGA (31×31).
• Power  Core voltage supply range of 825 mV to 876 mV for the FPGA core domain.
• Thermal and Grade  Extended grade device with an operating temperature range of 0°C to 100°C.
• Compliance and Mounting  RoHS compliant and supplied in a surface-mount FCBGA package.

Typical Applications

• High-density digital processing  Implement complex logic and datapath operations using the large logic element count and embedded memory.
• Multi-channel I/O systems  Leverage 304 I/O pins for interfacing multiple peripherals, sensors, or high-channel-count front ends.
• On-chip buffering and storage  Use approximately 31.6 Mbits of embedded RAM for local buffering, packet queues, or temporary storage.
• Platform prototypes and custom hardware  Utilize the programmable fabric and substantial resources for prototyping system-level FPGA designs.

Unique Advantages

• High logic density: Approximately 355,950 logic elements provide room for large-scale integration of custom logic blocks and state machines.
• Significant embedded memory: Roughly 31.6 Mbits of on-chip RAM reduces reliance on external memory for local buffering and accelerates data handling.
• Broad I/O capacity: 304 I/O pins support multi-channel interfacing and flexible board-level connectivity options.
• Compact surface-mount packaging: 900-FCBGA (31×31) package offers a dense solution for space-constrained board layouts.
• Controlled core power range: A defined core voltage supply range (825 mV to 876 mV) aids in power domain planning and regulator selection.
• RoHS compliant: Environmentally compliant manufacturing and end-of-life handling.

Why Choose XCKU3P-1FFVD900E?

The XCKU3P-1FFVD900E positions itself as a high-capacity, feature-rich FPGA option for designs that demand large logic resources, substantial on-chip memory, and extensive I/O in a compact surface-mount package. Its extended-grade rating and defined operating range provide predictable behavior across typical commercial temperature conditions.

This device is well suited to engineering teams building complex programmable systems that require integration of many logic functions and local memory without immediately resorting to large external memory subsystems. The combination of logic density, on-chip RAM, and 304 I/O delivers a scalable platform for advanced digital designs while maintaining RoHS compliance.

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