XCKU3P-1FFVA676E

The XCKU3P-1FFVA676E is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. It combines high logic capacity with substantial on-chip memory and a high I/O count in a 676-ball FCBGA package.

With 355,950 logic elements and approximately 31.6 Mbits of embedded memory, this device is intended for designs that require dense programmable logic, abundant embedded RAM, and significant I/O connectivity while operating within an extended temperature range.

Key Features

• Core Logic Capacity  355,950 logic elements implemented across 20,340 CLBs, providing substantial programmable fabric for complex digital functions.
• Embedded Memory  Approximately 31.6 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic.
• I/O Count  256 I/O pins to support high-pin-count interfaces and multiple parallel connections.
• Package & Mounting  676-ball FCBGA package (676-FCBGA, 27×27) / 676-BBGA case, designed for surface-mount PCBA assembly.
• Voltage Supply  Supply range specified at 825 mV to 876 mV to match targeted core voltage requirements.
• Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliance  Environmentally compliant with RoHS requirements.

Typical Applications

• Complex digital system design  Implement dense programmable logic and custom datapaths for proof-of-concept and production systems.
• Memory‑intensive FPGA functions  Use embedded RAM for buffering, packet processing, or other designs that require substantial on-chip memory.
• High‑pin‑count interfacing  Leverage 256 I/O pins for parallel interfaces, multi-channel data I/O, or board-level I/O aggregation.

Unique Advantages

• High logic density: 355,950 logic elements provide the capacity for complex state machines, custom accelerators, and wide datapaths.
• Substantial embedded memory: Approximately 31.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Ample I/O resources: 256 I/O pins enable flexible interfacing to peripherals, sensors, and board-level buses.
• Compact, high‑pin package: 676-FCBGA (27×27) delivers high connectivity in a surface-mount form factor suited to dense PCBA layouts.
• Extended operating range: 0 °C to 100 °C grade supports applications that require wider-than-commercial temperature performance.
• RoHS compliant: Meets environmental compliance requirements for many manufacturing programs.

Why Choose XCKU3P-1FFVA676E?

The XCKU3P-1FFVA676E positions itself as a high-capacity, memory-rich Kintex® UltraScale+™ FPGA option from AMD, combining extensive logic resources, significant embedded RAM, and a high I/O count in a compact FCBGA package. Its extended temperature grade and RoHS compliance make it suitable for designs that require reliable operation and environmental compliance.

This device is a practical choice for engineers and teams developing designs that demand large programmable fabric, on-chip memory, and numerous I/O signals—providing scalability and integration that help reduce external component requirements and simplify board-level design.

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