XCKU19P-L1FFVB2104I

The XCKU19P-L1FFVB2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD supplied in a 2104-FCBGA package (47.5×47.5 mm). It delivers very high logic capacity and embedded memory in a surface-mount industrial-grade device designed for demanding embedded and system-level implementations.

Key on-chip resources include 1,842,750 logic elements and approximately 63.75 Mbits of embedded RAM, with 540 available I/O pins. The device operates from 698 mV to 742 mV and across an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core Architecture Virtex® UltraScale+™ family device offering a high-density programmable fabric.
• Logic Capacity 1,842,750 logic elements to support complex combinational and sequential logic designs.
• Embedded Memory Approximately 63.75 Mbits of on-chip RAM for buffering, caching, and temporary data storage.
• I/O 540 user I/O pins to support wide external connectivity and multiple parallel interfaces.
• Power Core voltage supply range from 698 mV to 742 mV as specified for device operation.
• Package & Mounting 2104-FCBGA (2104-BBGA) package, surface-mount format; supplier package dimension 47.5×47.5 mm.
• Industrial Grade & Temperature Rated for industrial use with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High logic density: 1,842,750 logic elements enable implementation of large, complex FPGA designs without immediate need for multiple devices.
• Substantial embedded memory: Approximately 63.75 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path tasks.
• Broad I/O count: 540 I/O pins provide flexibility for systems requiring numerous parallel interfaces or diverse peripheral connections.
• Industrial temperature range: Operation from −40 °C to 100 °C supports deployment in environments requiring extended temperature tolerance.
• Compact high-pin-count package: 2104-FCBGA (47.5×47.5 mm) provides a dense footprint for high-performance system boards while maintaining surface-mount assembly compatibility.
• Regulatory alignment: RoHS compliance addresses material-restriction requirements for modern electronics manufacturing.

Why Choose XCKU19P-L1FFVB2104I?

The XCKU19P-L1FFVB2104I is positioned for designs that require substantial programmable logic resources, significant on-chip memory, and a high I/O count within an industrial temperature-capable FPGA. Its Virtex® UltraScale+™ family identity and the provided electrical, thermal, and packaging specifications make it suitable for system-level implementations where integration density and robust operating range are important selection criteria.

Choose this device when your application needs a single-device solution that combines large logic capacity, embedded memory, and extensive I/O in a RoHS-compliant, surface-mount 2104-FCBGA package rated for −40 °C to 100 °C operation.

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