XCKU19P-3FFVB2104E

The XCKU19P-3FFVB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers high logic capacity and embedded memory in a 2104-FCBGA package designed for surface-mount assembly.

Key device attributes include 1,842,750 logic elements, approximately 63.75 Mbits of on-chip RAM, 540 available I/O, an extended-grade operating range of 0 °C to 100 °C, and a specified supply window of 873 mV to 927 mV.

Key Features

• Logic Capacity  1,842,750 logic elements provide substantial programmable fabric for large, complex designs.
• Embedded Memory  Approximately 63.75 Mbits of on-chip RAM for buffering, caches, and data storage within user logic.
• I/O Resources  540 I/O pins support extensive connectivity and interfacing requirements without external multiplexing.
• Power Supply  Designed to operate within a core voltage window of 873 mV to 927 mV, enabling precise power management in system designs.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm) in a 2104-BBGA footprint for surface-mount PCB assembly.
• Operating Range & Grade  Extended-grade device rated for 0 °C to 100 °C operation to meet a wide set of deployment environments.
• Regulatory Compliance  RoHS-compliant material designation supports lead-free manufacturing processes.

Typical Applications

• Custom hardware acceleration  Use the large logic fabric and on-chip RAM to implement tailored acceleration blocks for compute-intensive tasks.
• High-density logic designs  Deploy complex state machines, data-paths, and control logic that benefit from the device's high logic element count.
• Memory-intensive processing  Leverage approximately 63.75 Mbits of embedded RAM for buffering, packet queues, and local storage within processing pipelines.
• I/O aggregation and bridging  540 I/O pins enable consolidation of multiple interfaces and protocol bridging on a single device.

Unique Advantages

• High integration of logic and memory: Combines 1,842,750 logic elements with substantial embedded RAM to reduce external memory dependencies.
• Extensive I/O capacity: 540 I/O pins simplify system-level connectivity and reduce the need for additional interface components.
• Compact FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) delivers dense integration suitable for space-constrained PCBs.
• Controlled supply window: Narrow 873 mV–927 mV voltage range supports disciplined power delivery and predictable core behavior.
• Extended operating range: Rated for 0 °C to 100 °C and marked as extended grade to meet a broader set of deployment conditions.
• RoHS compliant: Material compliance aligns with lead-free manufacturing requirements.

Why Choose XCKU19P-3FFVB2104E?

The XCKU19P-3FFVB2104E is positioned for designs that require large programmable logic capacity, significant on-chip RAM, and broad I/O reach in a single, surface-mount FCBGA package. Its extended operating range and clearly defined voltage window make it suitable for systems that demand stable, repeatable FPGA behavior across a range of environmental conditions.

Designers and procurement teams looking to implement complex, high-density FPGA solutions can rely on this device's combination of logic density, embedded memory, and packaging to deliver scalable, integrated hardware platforms while maintaining RoHS compliance.

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