XCKU19P-2FFVJ1760E

The XCKU19P-2FFVJ1760E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It combines high programmable logic capacity with substantial on-chip memory and a high I/O count in a 1760-FCBGA package.

This device targets designs that require large-scale programmable logic, significant embedded RAM, and dense external interfacing while operating within an extended grade temperature range.

Key Features

• High Logic Capacity – Provides 1,842,750 logic elements for complex, large-scale programmable logic implementations.
• Configurable Logic Blocks (CLBs) – 105,300 CLBs to structure and partition logic resources effectively.
• Embedded Memory – Approximately 63.75 Mbits of embedded memory (63,753,421 total RAM bits) for on-chip buffering, caches, and state storage.
• I/O Density – 540 I/O pins to support broad interfacing and high-channel-count connectivity.
• Package and Mounting – 1760-FCBGA (42.5×42.5 mm) ball-grid package, surface-mount for compact system integration.
• Power – Core voltage supply range of 0.825 V to 0.876 V to match system power-rail planning.
• Operating Range and Grade – Extended grade device rated for 0 °C to 100 °C operation.
• RoHS Compliant – Meets RoHS environmental compliance requirements.

Typical Applications

• High-density digital processing – Use the large logic element count and extensive CLBs to implement complex algorithmic and data-path designs.
• On-chip memory–intensive designs – Approximately 63.75 Mbits of embedded RAM supports buffering, lookup tables, and stateful processing without relying solely on external memory.
• High-pin-count interfaces – 540 I/Os enable multiple parallel interfaces, high-throughput data paths, and dense board-level connectivity.
• Compact system integration – The 1760-FCBGA surface-mount package provides a high-capacity FPGA solution in a compact footprint for space-constrained boards.

Unique Advantages

• Large programmable resource pool: 1,842,750 logic elements and 105,300 CLBs provide the capacity to implement extensive custom logic and partition complex designs.
• Substantial on-chip memory: Approximately 63.75 Mbits of embedded RAM reduces dependence on external memory for many use cases, simplifying board-level design.
• Broad external interfacing: 540 I/Os support multiple high-channel interfaces and flexible connectivity options.
• Compact BGA footprint: 1760-FCBGA (42.5×42.5 mm) enables high-density integration on surface-mount PCBs.
• Power and thermal predictability: Defined core supply range (0.825–0.876 V) and an operating temperature window (0 °C to 100 °C) help with system power and thermal planning.
• Environmentally compliant: RoHS compliance supports regulatory and sustainability requirements.

Why Choose XCKU19P-2FFVJ1760E?

The XCKU19P-2FFVJ1760E positions itself as a high-capacity, highly integrated FPGA for designs that demand extensive logic resources, significant embedded memory, and a large number of I/O connections. Its 1760-FCBGA package and surface-mount mounting make it suitable for compact, high-density boards while the extended grade and defined power range aid system-level planning.

This device is aimed at developers and procurement teams building complex programmable logic solutions that require scalability, on-chip memory resources, and a high I/O count, with RoHS compliance for environmental considerations.

Request a quote or submit an inquiry for the XCKU19P-2FFVJ1760E to receive pricing and availability information tailored to your design requirements.