XCKU19P-1FFVJ1760E

The XCKU19P-1FFVJ1760E is a Virtex® UltraScale+™ FPGA manufactured by AMD, supplied in a 1760-FCBGA surface-mount package. It delivers 1,842,750 logic elements, approximately 63.75 Mbits of embedded memory, and 540 I/O connections to support complex programmable logic designs.

Specified as Extended grade and designed for board-level integration, the device operates from 825 mV to 876 mV core supply and within an operating temperature range of 0 °C to 100 °C. The supplier device package measures 42.5 × 42.5 mm for compact footprint implementations.

Key Features

• Logic Capacity 1,842,750 logic elements for large-scale programmable logic and complex algorithm implementation.
• Embedded Memory Approximately 63.75 Mbits of on-chip RAM to support buffering, lookup tables, and data processing close to logic.
• I/O Resources 540 I/O connections to interface with multiple peripherals, high-speed links, and board-level signals.
• Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) surface-mount ball-grid array for dense board integration and reliable solder attachment.
• Power Core voltage supply range of 825 mV to 876 mV for defined power budgeting and supply design.
• Temperature and Grade Extended-grade device rated for operation from 0 °C to 100 °C to match extended commercial temperature requirements.

Unique Advantages

• High integration density: Large logic element count consolidates complex functions into a single device, reducing external component count.
• Substantial on-chip memory: Approximately 63.75 Mbits of embedded RAM reduces dependency on external memory for many buffering and data-processing tasks.
• Extensive I/O capability: 540 I/O connections enable broad system interfacing without needing additional I/O expanders.
• Compact board-level package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package simplifies PCB layout for high-density applications.
• Deterministic power envelope: Defined core supply range (825 mV–876 mV) helps with predictable power delivery and thermal planning.
• Extended operating range: Rated 0 °C to 100 °C to support applications requiring extended commercial temperature operation.

Why Choose XCKU19P-1FFVJ1760E?

Manufactured by AMD, the XCKU19P-1FFVJ1760E combines substantial programmable logic resources, significant embedded memory, and a high I/O count in a compact 1760-FCBGA surface-mount package. These attributes make it suitable for designs that require high integration density and extensive on-chip resources while maintaining controlled power and thermal characteristics.

The device's Extended grade rating and defined supply/temperature ranges provide predictable behavior for production designs that need reliable, long-term board-level integration.

Request a quote or submit a sales inquiry to obtain pricing, lead-time information, or to begin procurement for the XCKU19P-1FFVJ1760E.