XCKU15P-L2FFVE1760E

The XCKU15P-L2FFVE1760E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 1760-FCBGA package. It provides substantial on-chip resources including 1,143,450 logic elements, approximately 82 Mbits of embedded memory, and 668 I/O pins to support high-density digital designs.

Packaged in a 1760-FCBGA (42.5×42.5 mm) surface-mount device with an extended-grade operating range, this FPGA is designed where integration of large logic capacity, memory, and connectivity in a compact footprint is required.

Key Features

• Logic Capacity — 1,143,450 logic elements (65,340 CLBs) for implementing complex digital logic and custom architectures.
• Embedded Memory — Approximately 82 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Connectivity — 668 user I/O pins to interface with multiple peripherals, buses, and external devices.
• Power — Core voltage supply range of 698 mV to 876 mV, enabling defined operating conditions for the device.
• Package & Mounting — 1760-FCBGA package (42.5×42.5 mm) with surface-mount mounting for high-density PCB integration.
• Thermal & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant, meeting common lead-free requirements for electronic assemblies.

Unique Advantages

• High logic density: 1,143,450 logic elements enable large-scale integration of digital functions on a single device, reducing the need for multiple FPGAs.
• Significant on-chip memory: Approximately 82 Mbits of embedded RAM minimizes external memory dependencies and supports larger data buffering and state machines.
• Extensive I/O count: 668 I/O pins provide broad connectivity options for multi-channel interfaces and complex system interconnects.
• Compact FCBGA footprint: The 1760-FCBGA (42.5×42.5 mm) package delivers a high-resource device in a board-friendly surface-mount form factor.
• Extended operating range: Extended-grade classification and 0 °C to 100 °C operating temperature help align the device with applications requiring wider temperature tolerance.
• Regulatory readiness: RoHS compliance supports use in lead-free manufacturing processes and assemblies.

Why Choose XCKU15P-L2FFVE1760E?

The XCKU15P-L2FFVE1760E combines a very large logic fabric, substantial embedded memory, and extensive I/O in a single 1760-FCBGA package. This combination supports designs that require high integration density and scalable on-chip resources while keeping board-level complexity manageable.

With an extended-grade temperature range, defined core voltage window, and RoHS compliance, this FPGA is suited to engineering teams and procurement groups looking for a high-capacity programmable device that aligns with compact board layouts and established environmental requirements.

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