XCKU15P-L1FFVA1156I

The XCKU15P-L1FFVA1156I is an AMD Kintex® UltraScale+™ field programmable gate array delivered in a 1156-FCBGA (35×35) surface-mount package. It provides a high-density programmable fabric with 1,143,450 logic elements and approximately 82.33 Mbits of embedded memory.

Engineered for industrial environments, the device offers 516 I/O pins, a supply voltage range of 698 mV to 876 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for demanding, high-capacity designs that require robust thermal and electrical margins.

Key Features

• Programmable Logic  High density programmable fabric with 1,143,450 logic elements to implement complex digital functions and custom hardware architectures.
• Embedded Memory  Approximately 82.33 Mbits of on-chip RAM to support large buffering, state machines, and data-path storage without external memory for many use cases.
• I/O Density  516 available I/O pins to support multi-channel interfaces, parallel buses, and mixed-signal board topologies.
• Power Supply  Operates across a 698 mV to 876 mV supply range to match system power domains and enable controlled power budgeting.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for compact board integration and high-pin-count routing.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Manufacturer  Part of the AMD Kintex UltraScale+ family, providing a known FPGA architecture and form factor for system design planning.

Typical Applications

• High-density digital processing  System designs that require substantial programmable logic and embedded memory for acceleration, custom datapaths, or complex state machines.
• I/O-intensive systems  Applications needing a large number of external connections—516 I/O—such as multi-channel data aggregation or parallel bus interfaces.
• Industrial control and automation  Industrial-grade operation from −40 °C to 100 °C makes this device suitable for factory automation, robotics control, and process monitoring equipment.
• Custom hardware acceleration  Large logic and memory resources enable implementation of bespoke accelerators and hardware offloads within constrained power envelopes.

Unique Advantages

• High logic capacity: 1,143,450 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing BOM and system complexity.
• Substantial on-chip memory: Approximately 82.33 Mbits of embedded RAM decreases reliance on external memory for many buffering and caching needs.
• Broad I/O count: 516 I/O pins allow flexible system partitioning and support for numerous peripheral channels or parallel interfaces.
• Industrial thermal range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging installations without additional thermal derating.
• Compact high-pin-count package: 1156-FCBGA (35×35) provides dense routing capability in a surface-mount form factor suitable for compact system boards.
• Controlled supply window: Operates within a 698 mV to 876 mV supply range to align with modern power-rail designs and support predictable power budgeting.

Why Choose XCKU15P-L1FFVA1156I?

The XCKU15P-L1FFVA1156I positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive programmable logic, substantial embedded memory, and a large number of I/O. Its 1156-FCBGA surface-mount package and controlled supply range make it suitable for compact, power-conscious systems operating across a wide temperature range.

This device is appropriate for engineering teams building complex digital systems that benefit from consolidating functions into a single, robust FPGA platform from the Kintex UltraScale+ family. Its combination of logic density, memory, I/O flexibility, and industrial temperature rating supports scalable, long-lived deployments.

Request a quote or submit an inquiry for availability and pricing for XCKU15P-L1FFVA1156I. Our team will provide the information needed to evaluate this device for your design requirements.