XCKU15P-3FFVE1760E

The XCKU15P-3FFVE1760E is a Kintex® UltraScale+™ Field Programmable Gate Array from AMD designed for high-density programmable logic applications. It integrates approximately 1,143,450 logic elements, roughly 82.33 Mbits of embedded memory, and 668 I/O pins in a 1760‑FCBGA package.

This surface-mount, extended-grade device targets designs that require substantial on-chip logic capacity, significant embedded memory, and a high I/O count while operating within a 0 °C to 100 °C range and a supply window of 873 mV to 927 mV.

Key Features

• Core Logic Capacity Approximately 1,143,450 logic elements to support large-scale programmable implementations and complex logic functions.
• Embedded Memory Approximately 82.33 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic tasks.
• I/O 668 user I/O pins to accommodate wide bus interfaces, large peripheral sets, and multi-channel connectivity.
• Power Supply Range Nominal supply operating window from 873 mV to 927 mV to match system power-rail requirements.
• Package and Mounting 1760‑FCBGA package (1760-BBGA) with supplier package dimensions of 42.5 × 42.5 mm; surface-mount mounting for board-level integration.
• Temperature and Grade Extended grade device rated for operation from 0 °C to 100 °C to suit a range of commercial and extended-temperature designs.
• Regulatory Compliance RoHS-compliant to meet common environmental and manufacturing standards.

Typical Applications

• High-density digital processing Deploy large combinational and sequential logic functions where substantial on-chip logic and memory reduce external component count.
• Custom compute acceleration Implement hardware-accelerated functions that benefit from the device's high logic element count and embedded RAM.
• I/O-intensive systems Use the 668 I/O pins to consolidate multiple interfaces, enabling protocol aggregation, parallel data capture, or wide bus implementations.
• Complex system prototyping Validate and prototype complex SoC and ASIC functions on a single, high-capacity FPGA platform.

Unique Advantages

• High integration density: The large logic element count reduces the need for multi-device solutions, simplifying board design and BOM.
• Substantial on-chip memory: Approximately 82.33 Mbits of embedded RAM supports buffering and stateful algorithms without extensive external memory.
• Extensive I/O capability: 668 I/Os allow flexible interfacing to sensors, processors, and peripherals without multiple interface chips.
• Compact package: 1760‑FCBGA footprint with 42.5 × 42.5 mm supplier dimensions enables high-density board layouts while keeping assembly compatible with surface-mount processes.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet a broader set of deployment environments within extended commercial ranges.
• Environmental compliance: RoHS status supports regulatory and manufacturing requirements for lead-free assembly.

Why Choose XCKU15P-3FFVE1760E?

The XCKU15P-3FFVE1760E combines high logic capacity, significant embedded memory, and a large I/O complement in a single extended-grade FCBGA package, making it well suited to complex, high-density programmable designs. Its specified operating and supply ranges provide clear integration parameters for system architects and engineers working on memory- and I/O-intensive applications.

This device is appropriate for teams and projects that need to consolidate functionality onto a single FPGA footprint while maintaining flexibility for custom logic, buffering, and wide interface requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XCKU15P-3FFVE1760E.