XCKU15P-3FFVA1760E

The XCKU15P-3FFVA1760E is a field programmable gate array (FPGA) device in the Kintex® UltraScale+™ family by AMD. It provides a large array of programmable logic resources, on-chip memory, and a substantial number of I/O for use in reconfigurable hardware designs.

Built in a 1760-ball FCBGA package and specified for extended grade operation, this device targets system designs that require significant logic capacity, embedded memory, and board-level I/O density while operating within a defined core voltage and temperature range.

Key Features

• Logic Capacity — Approximately 1,143,450 logic elements to implement complex custom logic and large-scale designs.
• Configurable Logic Blocks — 65,340 programmable logic blocks (CLBs) to structure logic and routing resources across the device.
• Embedded Memory — Approximately 82.3 Mbits of on-chip RAM for buffering, FIFO, and storage functions within designs.
• I/O Density — 512 I/O pins to support extensive board-level interfacing and multiple peripheral connections.
• Package & Mounting — 1760-BBGA (1760-FCBGA) surface-mount package with supplier package size 42.5 × 42.5 mm for compact board integration.
• Power Supply Range — Core voltage supply specified from 873 mV to 927 mV to match system power rails and sequencing requirements.
• Temperature Grade — Extended grade operating range from 0 °C to 100 °C for deployment in temperature-controlled and general-purpose environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• FPGA-based system design — Acts as the central programmable logic device for reconfigurable hardware implementations.
• High-density I/O interfacing — Supports designs that require a large number of external connections with its 512 I/O pins.
• Memory-intensive functions — Uses approximately 82.3 Mbits of embedded memory for buffering, packet storage, or on-chip data handling.
• Custom logic implementation — Leverages roughly 1,143,450 logic elements for implementing extensive custom algorithms and datapaths.

Unique Advantages

• Large logic resource pool: Approximately 1,143,450 logic elements enable implementation of sizeable custom logic and parallel processing blocks.
• Substantial on-chip memory: Around 82.3 Mbits of embedded RAM reduces external memory dependencies for many buffering and storage tasks.
• High I/O count: 512 I/O pins provide flexibility for multi-channel interfaces and dense board connectivity.
• Compact FCBGA package: 1760-ball FCBGA (42.5 × 42.5 mm) supports dense board layouts while maintaining surface-mount assembly.
• Defined power and thermal parameters: Specified core voltage range (873 mV–927 mV) and extended temperature range (0 °C–100 °C) aid system power and thermal planning.
• RoHS compliant: Conforms to RoHS for environmental compliance in many supply chains.

Why Choose XCKU15P-3FFVA1760E?

The XCKU15P-3FFVA1760E combines a very large logic element count, substantial on-chip memory, and a high I/O pin count in a 1760-ball FCBGA package, delivering a balanced platform for FPGA-based system designs that require significant programmable resources. Its specified core voltage range and extended operating temperature make it suitable for general-purpose and temperature-controlled applications.

This device is intended for designers and procurement teams looking for a high-capacity FPGA from AMD with clear, verifiable hardware specifications for logic, memory, I/O, packaging, power, and operating range.

Request a quote or submit an inquiry to begin procurement or to receive pricing and availability information for XCKU15P-3FFVA1760E.