XCKU15P-2FFVE1760I

The XCKU15P-2FFVE1760I is a Field Programmable Gate Array (FPGA) IC in a 1760-BBGA (1760-FCBGA, 42.5×42.5 mm) package. It delivers a high logic element count and substantial on-chip memory together with a large number of I/O pins, packaged and rated for industrial operation.

Key device characteristics include approximately 1,143,450 logic elements, approximately 82.33 Mbits of embedded memory, 668 I/Os, surface-mount FCBGA packaging, a supply range of 825 mV to 876 mV, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  Approximately 1,143,450 logic elements for high-density digital designs and complex logic implementation.
• Embedded Memory  Approximately 82.33 Mbits of on-chip RAM to support data buffering, state storage, and intermediate processing.
• I/O Capacity  668 programmable I/O pins to support wide-ranging interface and connectivity needs.
• Power  Operates within a supply voltage window of 825 mV to 876 mV, suitable for systems designed around this core voltage range.
• Package & Mounting  1760-FCBGA (42.5×42.5 mm) package in surface-mount form factor for dense board-level integration.
• Temperature & Grade  Industrial-grade device with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded RAM for complex signal processing, algorithm acceleration, and custom compute pipelines.
• I/O-intensive systems  Leverage 668 I/Os for multi-channel data acquisition, protocol bridging, and extensive peripheral integration.
• Industrial control and automation  Industrial-grade temperature range and robust packaging make the device suitable for control systems, motor drives, and factory automation modules.

Unique Advantages

• High logic capacity: The approximately 1,143,450 logic elements enable large, complex designs without immediate need for multi-chip partitioning.
• Substantial on-chip memory: Approximately 82.33 Mbits of embedded RAM reduces reliance on external memory for many buffering and local storage tasks.
• Extensive connectivity: 668 I/O pins provide flexibility for multiple interfaces, sensors, and peripheral systems on a single FPGA.
• Industrial temperature rating: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial applications.
• Compact FCBGA package: 1760-FCBGA (42.5×42.5 mm) enables dense board layouts while maintaining high integration.
• RoHS compliant: Meets RoHS environmental requirements for regulated markets and product lines.

Why Choose XCKU15P-2FFVE1760I?

The XCKU15P-2FFVE1760I positions itself as a high-capacity, industrial-grade FPGA solution for engineers needing large logic resources, significant embedded memory, and extensive I/O in a compact FCBGA package. Its specified voltage range and wide operating temperature make it suitable for robust, long-running installations.

This device is well suited to designers building complex digital systems that require on-chip memory and high I/O counts while maintaining industrial operating tolerances. The combination of logic density, embedded RAM, and I/O capability provides a scalable platform for advanced embedded designs.

Request a quote or submit a pricing inquiry today to evaluate the XCKU15P-2FFVE1760I for your next high-density FPGA design.