XCKU15P-2FFVE1517E

The XCKU15P-2FFVE1517E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC supplied in a 1517-BBGA / 1517-FCBGA package. It provides a high-density programmable fabric with substantial embedded memory and a broad I/O complement for complex logic integration.

Key device attributes include approximately 1,143,450 logic elements, approximately 82.3 Mbits of embedded memory, 512 I/O, a specified voltage supply range of 825 mV to 876 mV, and an extended operating grade with a 0 °C to 100 °C temperature range. The device is RoHS compliant and designed for surface-mount placement.

Key Features

• Core Logic: Approximately 1,143,450 logic elements for high-density programmable logic integration and complex design implementation.
• Embedded Memory: Approximately 82.3 Mbits of on-chip RAM to support large data buffering, state storage, and memory-intensive logic functions.
• I/O Capacity: 512 general-purpose I/O pins to support wide peripheral, interface, and board-level connectivity requirements.
• Power Supply Range: Specified voltage supply of 825 mV to 876 mV, enabling precise power budgeting and design planning.
• Package and Mounting: 1517-BBGA / 1517-FCBGA package (supplier device package: 1517-FCBGA (40×40)), optimized for surface-mount assembly.
• Operating Grade and Temperature: Extended grade with an operating temperature range of 0 °C to 100 °C for broader environmental tolerance.
• Environmental Compliance: RoHS compliant, meeting common lead-free environmental standards.

Unique Advantages

• High-density logic capacity: Approximately 1,143,450 logic elements enable implementation of complex, large-scale digital designs without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 82.3 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Generous I/O count: 512 I/O pins provide flexibility for wide parallel interfaces and diverse peripheral connections on the same FPGA.
• Compact FCBGA package: 1517-FCBGA (40×40) package supports dense board layouts while remaining surface-mount compatible.
• Controlled power envelope: Defined voltage supply range (825 mV–876 mV) assists designers in precise power delivery and thermal planning.
• Extended operating range: Extended grade with 0 °C–100 °C operation supports a variety of commercial and industrial-adjacent environments.

Why Choose XCKU15P-2FFVE1517E?

The XCKU15P-2FFVE1517E positions itself as a high-density Kintex UltraScale+ FPGA option that combines a large logic element count, substantial on-chip memory, and a broad I/O complement in a 1517-FCBGA surface-mount package. Its specified voltage supply range and extended operating grade provide clear design parameters for power delivery and thermal management.

This part is suited to teams and applications that require considerable programmable logic capacity and embedded memory on a single device, along with flexible I/O for complex board-level integration. RoHS compliance and the defined package and temperature specifications support long-term procurement and production planning.

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