XCKU15P-2FFVA1760E

The XCKU15P-2FFVA1760E is an AMD Kintex® UltraScale+™ field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It delivers high logic density and substantial on-chip memory in a surface-mount 1760-FCBGA footprint (42.5×42.5 mm), with extended-grade temperature support.

Key device attributes include 1,143,450 logic elements, approximately 82.3 Mbits of embedded memory, 512 I/O pins, a narrow operating supply range, and RoHS compliance—making it suitable for designs that require large programmable logic capacity and significant embedded RAM.

Key Features

• Logic Density 1,143,450 logic elements to support complex, high-density programmable logic implementations.
• Embedded Memory Approximately 82.3 Mbits of on-chip RAM (total RAM bits: 82,329,600) for data buffering, FIFOs, and memory-intensive functions.
• I/O Capability 512 I/O pins to accommodate large numbers of external interfaces and parallel connections.
• Voltage Supply Operates with a supply range of 825 mV to 876 mV, enabling precise supply planning for the FPGA core domain.
• Package & Mounting 1760-FCBGA package case (1760-BBGA) with a 42.5×42.5 mm footprint, designed for surface-mount PCB assembly.
• Temperature & Grade Extended grade device with an operating temperature range of 0°C to 100°C.
• Environmental Compliance RoHS compliant for reduced hazardous substance content.

Unique Advantages

• High programmable capacity: The 1,143,450 logic elements provide the headroom to implement complex logic, custom accelerators, and large-scale designs.
• Significant on-chip memory: Approximately 82.3 Mbits of embedded RAM reduces external memory dependencies for buffering and data processing.
• Large I/O count: 512 I/O pins allow broad peripheral connectivity and parallel data paths without compromising signal routing options.
• Compact FCBGA footprint: 1760-FCBGA (42.5×42.5 mm) package provides a compact, high-pin-count solution for dense board layouts.
• Predictable power window: A defined supply range of 825 mV–876 mV supports focused power-supply design and validation efforts.
• Extended operating range and RoHS compliance: Extended grade temperature support (0°C–100°C) combined with RoHS compliance aligns with environmental and operational requirements.

Why Choose XCKU15P-2FFVA1760E?

The XCKU15P-2FFVA1760E positions itself as a high-density, memory-rich FPGA option within the Kintex UltraScale+ family. Its combination of over one million logic elements, substantial embedded RAM, and 512 I/Os in a 1760-FCBGA surface-mount package makes it suitable for designs that require large programmable resources in a defined package footprint and operating envelope.

Customers who need scalable logic capacity, substantial on-chip memory, and a predictable supply and thermal profile will find this device delivers integration and design continuity, backed by AMD's Kintex UltraScale+ architecture and RoHS compliance.

Request a quote or submit a sales inquiry for the XCKU15P-2FFVA1760E to receive pricing and availability information tailored to your project requirements.