XCKU15P-2FFVA1156I

The XCKU15P-2FFVA1156I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD in a 1156-ball FCBGA package. It provides high logic capacity and on-chip memory combined with a large I/O count, suitable for industrial-grade designs requiring robust operating ranges and surface-mount packaging.

Key device attributes include 1,143,450 logic elements, approximately 82.3 Mbits of embedded memory, 516 I/O, an industrial operating temperature range of −40 °C to 100 °C, and a supply voltage range of 825 mV to 876 mV.

Key Features

• Core Logic 1,143,450 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory Approximately 82.3 Mbits of on-chip RAM for large buffering, lookup tables, and state storage.
• I/O Capacity 516 user I/O pins to support dense peripheral and interface integration on modern boards.
• Power Supply Operates from a defined supply range of 825 mV to 876 mV to match system power rail requirements.
• Package & Mounting 1156-ball FCBGA (35 × 35 mm) surface-mount package for compact, high-density board designs.
• Industrial Temperature Grade Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• Compliance RoHS compliant, supporting lead-free assembly and regulatory requirements for electronics manufacturing.

Typical Applications

• High-density logic designs Suitable for projects requiring a very large number of logic elements and substantial on-chip memory.
• Interface aggregation Use where 500+ I/O are needed to consolidate multiple sensors, peripherals, or protocol endpoints.
• Industrial systems Deployed in equipment that requires operation across −40 °C to 100 °C and surface-mount packaging.

Unique Advantages

• Extensive programmable capacity: 1,143,450 logic elements enable complex logic integration and system consolidation, reducing external component count.
• Significant on-chip memory: Approximately 82.3 Mbits of RAM supports buffering, data processing, and state storage without heavy external memory reliance.
• High I/O density: 516 I/O pins allow flexible interfacing and reduce the need for additional I/O expanders or multiplexing logic.
• Industrial-grade operation: Rated for −40 °C to 100 °C operation, providing stability in a wide range of environments.
• Compact FCBGA package: 1156-ball, 35 × 35 mm surface-mount format supports high-density PCB designs and scalable board layouts.
• RoHS compliant: Supports lead-free manufacturing processes and regulatory compliance for global production.

Why Choose XCKU15P-2FFVA1156I?

The XCKU15P-2FFVA1156I positions itself as a high-capacity, industrial-grade FPGA option from AMD, combining large programmable logic resources, substantial embedded memory, and extensive I/O in a compact 1156-FCBGA package. Its defined supply range and wide operating temperature make it suitable for designs that demand both performance and environmental robustness.

This device is well suited for engineers and procurement teams building complex digital systems that benefit from on-chip integration, high I/O counts, and industrial temperature tolerance, providing long-term value through scalable logic and memory resources.

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