XCKU15P-1FFVE1760I

The XCKU15P-1FFVE1760I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC designed for high-density, industrial-grade digital designs. It provides large on-chip logic and memory resources along with extensive I/O, making it suitable for systems that require significant integration of programmable logic and embedded memory.

Key value comes from its combination of logic capacity, embedded RAM, broad I/O count, and an industrial operating temperature range, enabling deployment in demanding environments where component-level robustness and integration matter.

Key Features

• Logic Capacity  Approximately 1,143,450 logic elements and 65,340 configurable logic blocks (CLBs) to implement complex digital designs and custom hardware functions.
• Embedded Memory  Approximately 82 Mbits of on-chip RAM, supporting large data buffering, FIFOs, and memory-intensive algorithms.
• I/O Density  668 user I/O pins provide extensive external connectivity for high-speed interfaces, sensor arrays, or parallel data paths.
• Power and Supply  Operates from a core voltage range of 825 mV to 876 mV, enabling defined power planning for system designers.
• Package and Mounting  1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for compact, board-level integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to support deployment in a wide range of environmental conditions.
• Regulatory Compliance  RoHS‑compliant, supporting regulatory and sustainability requirements for electronic assemblies.

Typical Applications

• High-density digital processing  Implements large-scale custom logic and data-paths where significant logic and memory resources are required.
• Communication and networking equipment  Provides the I/O density and on-chip memory useful for packet processing, protocol handling, and interface aggregation.
• Industrial control and automation  Supports complex control algorithms and sensor interfacing across extended temperature ranges common in industrial environments.

Unique Advantages

• Substantial programmable logic:  Over one million logic elements enable implementation of large, consolidated hardware functions and system-on-chip style architectures.
• Significant embedded memory:  Approximately 82 Mbits of on-chip RAM reduces dependence on external memory and simplifies board-level designs for buffering and data handling.
• High I/O count:  668 I/O pins provide flexibility to interface with multiple peripherals, parallel buses, and high-channel-count systems without extensive external multiplexing.
• Industrial robustness:  Rated for −40 °C to 100 °C operation, making the device suitable for temperature-challenging installations and longer-term reliability in fielded systems.
• Compact FCBGA package:  1760-FCBGA (42.5 × 42.5 mm) offers a balance of density and board-space efficiency for advanced system designs.
• RoHS compliant:  Supports environmental compliance goals for manufacturing and deployment.

Why Choose XCKU15P-1FFVE1760I?

The XCKU15P-1FFVE1760I brings together very large logic capacity, substantial embedded RAM, and a high I/O count in a single industrial-grade FCBGA package. These characteristics make it well suited for engineers building complex digital systems that require on-chip resources to minimize external components and streamline board designs.

For development teams focused on scalability and reliability, this FPGA offers the resource set and temperature rating needed for demanding applications, while enabling compact integration through its 1760-FCBGA footprint and surface-mount mounting.

Request a quote or submit a product inquiry today to discuss availability, pricing, and how XCKU15P-1FFVE1760I can fit into your next design.