XCKU15P-1FFVA1760I

The XCKU15P-1FFVA1760I is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD, offered in a 1760-FCBGA package. It provides very large logic capacity, substantial embedded memory, and a high count of I/O for designs that require dense programmable logic and extensive interfacing.

Targeted at industrial applications, this device combines approximately 1,143,450 logic elements, roughly 82.33 Mbits of on-chip RAM, and 512 I/Os, with a core voltage supply range of 825 mV to 876 mV and an operating temperature range of -40°C to 100°C.

Key Features

• Core Logic Approximately 1,143,450 logic elements providing high-capacity programmable logic for complex implementations.
• Embedded Memory Approximately 82.33 Mbits of on-chip RAM to support large buffering, data staging, and embedded storage.
• I/O Resources 512 general-purpose I/Os to support wide external interfacing and parallel connectivity.
• Power Core supply voltage range of 825 mV to 876 mV for defined power planning and system-level integration.
• Package 1760-FCBGA package (1760-BBGA, FCBGA noted) with supplier package listing 1760-FCBGA (42.5x42.5) for dense board-level integration.
• Operating Range Rated for industrial temperature operation from -40°C to 100°C.
• Compliance RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High-density digital processing Use where large logic capacity and embedded memory are required to implement complex algorithms and custom datapaths.
• Packet processing and data buffering Leverage the sizable on-chip RAM and abundant I/O to handle parallel data streams and buffering tasks.
• Industrial control and automation Deploy in industrial systems that benefit from the device’s operating temperature range and high I/O count for sensor and actuator interfacing.

Unique Advantages

• High logic integration: Over one million logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
• Significant on-chip memory: Approximately 82.33 Mbits of embedded RAM supports large data sets and reduces dependence on external memory.
• Large I/O footprint: 512 I/Os simplify connectivity to peripherals, interfaces, and parallel buses without extensive external multiplexing.
• Industrial temperature rating: Operation from -40°C to 100°C supports deployment in temperature-challenging industrial environments.
• Defined power envelope: A specific core voltage range (825 mV–876 mV) aids in predictable power-supply design and thermal planning.
• RoHS compliance: Environmentally compliant construction for regulated markets and procurement requirements.

Why Choose XCKU15P-1FFVA1760I?

The XCKU15P-1FFVA1760I positions itself where high logic density, substantial embedded memory, and broad I/O capability are required within an industrial-rated FPGA package. Its defined core voltage range and wide operating temperature span make it suitable for demanding system designs that need predictable power and environmental performance.

This device is well suited to designers and teams looking to consolidate complex functions into a single programmable device, simplify board-level interfaces, and maintain compliance with RoHS requirements while leveraging the Kintex® UltraScale+™ architecture.

Request a quote or submit a pricing and availability inquiry to receive detailed procurement information for the XCKU15P-1FFVA1760I.