XCKU15P-1FFVE1517E

The XCKU15P-1FFVE1517E is an AMD Kintex® UltraScale+™ field programmable gate array supplied in a 1517-FCBGA (40×40) surface-mount package. It delivers very large logic capacity and embedded memory for designs that require substantial on-chip resources and a high I/O count.

With approximately 1,143,450 logic elements, about 82.3 Mbits of embedded memory, and 512 user I/O, this extended-grade FPGA targets complex digital systems where integration density, I/O connectivity, and temperature robustness between 0 °C and 100 °C are important design considerations.

Key Features

• Logic Capacity  Approximately 1,143,450 logic elements to support large-scale digital designs and complex custom logic implementations.
• Embedded Memory  Approximately 82.3 Mbits of on-chip RAM to store large datasets, buffering, and state information without external memory in some use cases.
• I/O Count  512 user I/O pins provide broad interface options for system-level integration and connectivity with peripherals and subsystems.
• Power Supply Range  Operates at a core supply range of 825 mV to 876 mV, enabling designs that require a defined low-voltage core rail.
• Package and Mounting  1517-BBGA / 1517-FCBGA (40×40) surface-mount package for compact board-level integration and automated assembly.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployments that need broader-than-commercial thermal tolerance.
• Compliance  RoHS compliant to meet standard environmental and material requirements.

Typical Applications

• High-density digital processing  Use the large logic element count and substantial on-chip RAM for custom datapath implementations and algorithm acceleration within a single device.
• Communications and I/O aggregation  512 I/O pins enable integration of multiple serial and parallel interfaces for data routing, protocol bridging, and front-end aggregation tasks.
• Prototyping and system development  Extensive logic and memory resources make the device suitable for hardware prototyping and proof-of-concept platforms that require significant on-chip capabilities.
• Instrumentation and test systems  The combination of high logic density and abundant I/O supports complex control, measurement, and signal-conditioning functions on a single FPGA.

Unique Advantages

• High on-chip integration:  Large logic capacity and substantial embedded memory reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Broad I/O availability:  512 user I/O pins provide flexibility to connect many peripherals and interfaces without extensive external multiplexing.
• Compact FCBGA package:  The 1517-FCBGA (40×40) package enables high-density PCB layouts while remaining compatible with surface-mount assembly processes.
• Extended temperature range:  Rated from 0 °C to 100 °C to support applications that require operation beyond typical commercial limits.
• Controlled core voltage:  A defined supply range of 825 mV to 876 mV supports predictable core power design and power-management strategies.
• RoHS compliant:  Meets common environmental material standards for global manufacturing and distribution.

Why Choose XCKU15P-1FFVE1517E?

The XCKU15P-1FFVE1517E combines a very large logic fabric with significant on-chip memory and a high I/O count in a compact, surface-mount FCBGA package. Its extended-grade thermal rating and controlled core supply range provide predictable behavior for demanding system-level designs that need integration and robust operation.

This FPGA is well suited to engineers and system designers building large-scale digital processing, complex I/O aggregation, and advanced prototyping platforms. Backed by AMD as the manufacturer and delivered in a 1517-FCBGA (40×40) package, it offers a single-device option for reducing component count while maintaining design flexibility.

Request a quote or submit your inquiry to get pricing and availability for the XCKU15P-1FFVE1517E today.